US2008298039A1PendingUtilityA1

Electron device having metallic connecting structure and method for making the same

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Assignee: HON FU JIN PREC INDUSTRY SHENZPriority: May 30, 2007Filed: Aug 23, 2007Published: Dec 4, 2008
Est. expiryMay 30, 2027(~0.8 yrs left)· nominal 20-yr term from priority
Inventors:Jin Zhou
Y10T29/49144Y10T29/49117Y10T29/49002H01R 4/04H01R 43/0207Y10T29/4913
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Claims

Abstract

An exemplary electronic device having a metallic connecting structure includes a metallic housing, at least one bonding film and at least one metallic clip. The at least one metallic clip includes a base and a U-shaped elastic portion, the U-shaped elastic portion having a pair of feet portions extending from the base and bending up and outwards. The metallic clip is fixed to an inner surface of the metallic housing via the bonding film.

Claims

exact text as granted — not AI-modified
1 . An electronic device having a metallic connecting structure, the electronic device comprising:
 a metallic housing;   at least one bonding film; and   at least one metallic clip comprising a base and a U-shaped elastic portion, the U-shaped elastic portion having a pair of feet portions extending from the base and bending up and outwards, wherein the at least one metallic clip is fixed to an inner surface of the metallic housing via the bonding film.   
   
   
       2 - 6 . (canceled) 
   
   
       7 . The electronic device having metallic connecting structure according to  claim 1 , wherein the bonding film is a thermoplastic adhesive bonding film.

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