US2008301943A1PendingUtilityA1

Method of combining heat pipe and fins and the assembly thereof

Assignee: TAI SOL ELECTRONICS CO LTDPriority: Jun 5, 2007Filed: Aug 30, 2007Published: Dec 11, 2008
Est. expiryJun 5, 2027(~0.8 yrs left)· nominal 20-yr term from priority
Inventors:Ko-Pin Liu
H10W 40/226H10W 40/73H10W 40/037F28F 1/32B23K 1/0012F28D 15/0275Y10T29/49353
28
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Claims

Abstract

The present invention provides a method of combining heat pipes and fins and the assembly thereof. The fins are stacked, each of which has holes, extending walls around the holes, lateral plates beside the extending walls to form a receiving portion therein communicated with a first opening of the extending wall respectively. The fins are placed with the receiving portions under the holes first. A solder material is injected into the receiving portions by a needle. The heat pipes are inserted into the holes of the fins, and then the fins are tipped over to have the receiving portions above the holes. Now the fins are heated to melt the solder material, and the molten solder material will flow to spaces between the heat pipe and the extending walls of the fins to fix the heat pipes to the fins.

Claims

exact text as granted — not AI-modified
1 . A method of combining at least one heat pipe and a plurality of fins, comprising the steps of:
 a) preparing the heat pipe and the fins, wherein the fins are stacked, each of which has at least one hole for the heat pipe passing therethrough, at least one extending wall, which has a first opening, around the hole, at least one lateral plate beside the extending wall to form a receiving portion therein and a second opening aligned with the first opening of the extending wall;   b) adjusting angles of the fins to have the receiving portions under the first openings, and inserting a needle into the holes of the fins to inject a solder material into the receiving portions via the second openings respectively;   c) inserting the heat pipe into the holes of the fins;   d) tipping the fins and over to have the receiving portion above the first openings;   e) heating the fins and the heat pipe to melt the solder material, so that the molten solder material will flow to spaces between the heat pipe and the extending walls of the fins through the second openings and the first openings respectively; and   f) cooling the solder material to fix the heat pipe to the extending walls of the fins and increase contacting areas of the heat pipe and the extending walls.   
   
   
       2 . The method as defined in  claim 1 , wherein the solder material in the step b is tin. 
   
   
       3 . The method as defined in  claim 2 , wherein the fins are against distal ends of the extending wall and the lateral plate of the neighboring fins, and the extending walls and the lateral plate have the same widths in the step a. 
   
   
       4 . The method as defined in  claim 3 , wherein the receiving portion is formed by bending the fin to have the lateral plate with a U shape in step a, and the second opening is formed at an open end of the U shape. 
   
   
       5 . The method as defined in  claim 3 , wherein the receiving portion is formed on the fin in such a way that two lateral plates are formed from the fin by stamping with ends thereof proximal to each other and opposite ends thereof distal to each other in the step a, and the opposite ends thereof distal to each other forms the second opening. 
   
   
       6 . An assembly of the at least one heat pipe and the fins made by the method as defined in  claim 1 , comprising:
 a plurality of fins stacking, each of which has at least one hole aligned with each other, at least one extending wall, which has a first opening, around the hole, and at least one lateral plate with a receiving portion and a second opening aligned with the first opening respectively;   at least a heat pipe inserted through the holes of the fins;   a solder material filled in spaces between the heat pipe and the extending walls of the fins.   
   
   
       7 . The assembly as defined in  claim 6 , wherein the solder material is tin. 
   
   
       8 . The assembly as defined in  claim 7 , wherein the fins are against distal ends of the extending wall and the lateral plate of the neighboring fins, and the extending walls and the lateral plate have the same widths. 
   
   
       9 . The assembly as defined in  claim 8 , wherein the receiving portion is formed by bending the fin to have the lateral plate with a U shape, and the second opening is formed at an open end of the U shape. 
   
   
       10 . The method as defined in  claim 8 , wherein the receiving portion is formed on the fin in such a way that two lateral plates are formed from the fin by stamping with ends thereof proximal to each other and opposite ends thereof distal to each other in the step a, and the opposite ends thereof distal to each other forms the second opening.

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