Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor

Abstract

The present disclosure relates to a fingerprint sensor device. The device comprises a sensor having a sensitive active region that is electrically connected to a substrate. The device further includes a first resin bump positioned proximate to the sensitive active region. The first resin bump forms a finger guide that positions the finger over the sensitive active region when the finger slides in contact with the first resin bump.

1 . A device, comprising:
 a substrate;   a fingerprint sensor having a first side and a second side, the first side attached to the substrate, the fingerprint sensor being electrically connected to the substrate and having a sensitive active region defined on the second side of the fingerprint sensor; and   a first resin bump positioned proximate to the sensitive active region of the fingerprint sensor so that a finger that is in contact with the first resin bump is also in contact with the sensitive active region, the first resin bump forming a finger guide that positions the finger over the sensitive active region when the finger slides in contact with the first resin bump.   
   
   
       2 . The device of  claim 1 , wherein the first resin bump has a height of at least 500 microns. 
   
   
       3 . The device of  claim 1 , wherein the first resin bump is positioned over a portion of the fingerprint sensor and a portion of the substrate. 
   
   
       4 . The device of  claim 1 , wherein a second resin bump is positioned at an opposite end of the fingerprint sensor from the first resin bump. 
   
   
       5 . The device of  claim 4 , wherein the second resin bump is positioned over a portion of the fingerprint sensor and a portion of the substrate. 
   
   
       6 . The device of  claim 5 , wherein a resin layer covers the sensitive active region to protect the surface of the active region. 
   
   
       7 . The device of  claim 1 , wherein the electrical connection comprises wire bonding wire. 
   
   
       8 . The device of  claim 7 , wherein the first resin bump covers the entire electrical connection. 
   
   
       9 . The device of  claim 1 , wherein the first resin bump has a height that is less than one millimeter from the fingerprint sensor. 
   
   
       10 . A fingerprint sensor, comprising:
 an integrated circuit chip having a first side that is longer than a second side;   a substrate including electrical connections;   an electrical wire connecting the second side of the integrated circuit chip to the electrical connections; and   a protective resin that covers a portion of the substrate and a portion of the integrated circuit chip and encapsulates the electrical wire, the protective resin forming a first bump that constitutes a guide for a finger when the finger slides over the integrated circuit chip substantially perpendicular to the first side of the chip.   
   
   
       11 . The fingerprint sensor of  claim 10 , wherein the first bump has a height of at least 500 microns. 
   
   
       12 . The fingerprint sensor of  claim 10 , wherein the protective resin forms a second bump positioned at an opposite end of the integrated circuit chip from the first bump. 
   
   
       13 . The fingerprint sensor of  claim 12 , wherein the second bump is positioned over a portion of the integrated circuit chip and a portion of the substrate. 
   
   
       14 . The fingerprint sensor of  claim 13 , wherein a protective resin covers the integrated circuit chip to protect the surface of the integrated circuit chip. 
   
   
       15 . The fingerprint sensor of  claim 10 , wherein the electrical wire comprises a wire bonding wire. 
   
   
       16 . The fingerprint sensor of  claim 10 , wherein the first bump has a height that is less than one millimeter above the fingerprint sensor.