System and method for mounting a cooling device and method of fabrication

Abstract

A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.

1 . A mounting apparatus for a cooling device, comprising:
 a plurality of connectors extending outwardly from the cooling device; and   at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.   
   
   
       2 . The mounting apparatus of  claim 1 , wherein each of the plurality of connectors comprises a compliant material. 
   
   
       3 . The mounting apparatus of  claim 2 , wherein the compliant material comprises an elastomeric material. 
   
   
       4 . The mounting apparatus of  claim 1 , wherein the plurality of connectors comprises a plurality of tendons. 
   
   
       5 . The mounting apparatus of  claim 1 , wherein the plurality of connectors comprises a plurality of tabs. 
   
   
       6 . The mounting apparatus of  claim 1 , wherein the plurality of connectors is formed integral into an E-clip mounting apparatus. 
   
   
       7 . The mounting apparatus of  claim 1 , wherein the plurality of connectors is configured to mount the cooling device at an angle transverse to the substrate. 
   
   
       8 . The mounting apparatus of  claim 1 , wherein the plurality of connectors is configured to mount the cooling device in a plane perpendicular to a plane of the substrate. 
   
   
       9 . The mounting apparatus of  claim 1 , wherein the substrate is a printed circuit board assembly. 
   
   
       10 . A method of mounting a cooling device, comprising:
 disposing at least one mounting post on a substrate; and   mounting a cooling device on the mounting post by way of a plurality of connectors extending outwardly from the cooling device.   
   
   
       11 . The method of  claim 10 , wherein the mounting by way of a plurality of connectors comprises extending a compliant material outwardly to form the plurality of connectors. 
   
   
       12 . The method of  claim 11 , wherein the extending comprises forming a plurality of tendons. 
   
   
       13 . The method of  claim 11 , wherein the extending comprises forming a plurality of tabs. 
   
   
       14 . The method of  claim 11 , wherein the extending comprises forming an E-clip. 
   
   
       15 . The method of  claim 10 , wherein the mounting comprises mounting the cooling device at an angle transverse to a plane of the substrate. 
   
   
       16 . A method of fabricating a cooling device comprising at least one plate defining a chamber, at least one active material on the at least one plate, and a compliant material within the at least one plate and encompassing the chamber, the compliant material having at least one opening facilitating fluid communication between the chamber and an exterior environment, said method comprising:
 disposing an active material on the plate, wherein said disposing comprises at least one selected from the group consisting of dispensing the active material via an automated system, thermally curing a preformed membrane of active material with the plate via an adhesive, ultraviolet light curing a preformed membrane of active material with the plate via an adhesive, and applying a preformed pressure sensitive tape to the plate.   
   
   
       17 . A cooling device, comprising:
 at least one supporting structure, including:   an inner surface defining a chamber and having a pair of grooves; and   at least one opening facilitating fluid communication between the chamber and an exterior environment; and   a pair of flexible plates, each said plate being disposed within one of the pair of grooves.   
   
   
       18 . The cooling device of  claim 17 , wherein the supporting structure comprises a metallic structure. 
   
   
       19 . The cooling device of  claim 17 , wherein the supporting structure comprises a composite resin. 
   
   
       20 . The cooling device of  claim 17 , wherein the supporting structure is configured to tune a structural frequency equal to about a Helmholtz frequency. 
   
   
       21 . The cooling device of  claim 17 , further comprising a though board clip to mount on a printed circuit board. 
   
   
       22 . The cooling device of  claim 17 , further comprising at least one pinned connection via an E-clip to mount on a printed circuit board. 
   
   
       23 . A cooling device comprising:
 a supporting frame, including:   an inner surface defining a chamber; and   at least one opening facilitating fluid communication between the chamber and an exterior environment; and   a pair of suspended jet plates, each suspended jet plate attached to the supporting frame.   
   
   
       24 . The cooling device of  claim 23 , wherein the suspended jet plates are attached via a compliant adhesive. 
   
   
       25 . The cooling device of  claim 23 , wherein the suspended jet plates are attached via a plurality of cantilevers. 
   
   
       26 . A cooling device comprising:
 a cup shaped supporting structure, comprising:   an inner surface defining a chamber;   an orientation plate attached to a base and configured to provide angular orientation; and   at least one opening facilitating fluid communication between the chamber and an exterior environment; and   a pair of flexible plates, each said plate being attached to the cup shaped supporting structure via an attachment.   
   
   
       27 . The cooling device of  claim 26 , wherein the cup shaped supporting structure comprises a V-shaped notch. 
   
   
       28 . The cooling device of  claim 26 , wherein the attachment comprises a metal support. 
   
   
       29 . A modular cooling device comprising:
 a pair of flexible discs having at least one opening facilitating fluid communication between a chamber and an exterior environment; and   a pair of electrical terminals configured to provide a parallel electrical connection to a second cooling device.   
   
   
       30 . The modular cooling device of  claim 29 , wherein the flexible discs comprise sandwich shaped discs. 
   
   
       31 . The modular cooling device of  claim 29 , further comprising at least two cooling devices in a parallel electrical connection. 
   
   
       32 . A method of mounting a cooling device on a printed circuit board comprising:
 disposing a plurality of mounting posts on the cooling device to orient the cooling device at an angle relative to the circuit board and forming a region under the cooling device; and   disposing a plurality of electronic components that do not require cooling in the region under the cooling device.