US2008311794A1PendingUtilityA1

Modular jack with removable contact array

Assignee: SAMTEC INCPriority: Sep 12, 2006Filed: Aug 14, 2008Published: Dec 18, 2008
Est. expirySep 12, 2026(~0.1 yrs left)· nominal 20-yr term from priority
H01R 12/57H01R 43/22H01R 13/506H01R 24/64H01R 25/006
41
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A modular jack includes a housing having a socket and an opening arranged to receive a modular plug into the socket, and a sled including a contact array arranged within the socket, wherein the sled is removable from the socket through the opening of the housing without disassembling the housing.

Claims

exact text as granted — not AI-modified
1 . A method of replacing a modular jack comprising:
 providing a modular jack including a housing having a socket and an opening arranged to receive a modular plug into the socket;   providing a sled including a contact array arranged within the socket; and   removing the sled through the opening of the housing without disassembling the housing.   
   
   
       2 . The method of replacing a modular jack according to  claim 1 , wherein the step of removing the sled includes:
 inserting a tool into the socket between the sled and the housing to disengage the sled from the housing.   
   
   
       3 . The method of replacing a modular jack according to  claim 1 , further comprising:
 providing the sled with at least one additional component arranged to modify at least one signal transmitted through the modular jack, wherein the at least one additional component is arranged on the sled such that the at least one additional component is removed from the housing when the sled is removed from the housing.   
   
   
       4 . The method of replacing a modular jack according to  claim 3 , wherein the at least one additional component is arranged to modify the signal through at least one of amplification, noise suppression, noise filtration, impedance matching, voltage isolation, magnetic filtering, ESD protection, resistive termination, shunt programming, solid state/active compensation, and differential signal equalization.

Join the waitlist — get patent alerts

Track US2008311794A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.