Chemical mechanical planarization pad and method of use thereof

Abstract

A web-style polishing pad includes a guide layer through which individual polishing elements protrude on one side and a flexible under-layer attached to the other side. The polishing elements may be affixed at their base to the compressible under-layer and pass through corresponding holes in the guide layer so as to be maintained and translatable in a substantially orthogonal orientation with respect to a plane defined by the guide layer.

1 . A polishing pad, comprising a sheet-like guide layer having holes therein, a plurality of individual polishing elements protruding through said holes, and a sheet-like flexible under-layer affixed to the guide layer so as to maintain the polishing elements in a substantially orthogonal orientation with respect to a plane defined by the guide layer, the polishing elements further being translatable along an axis orthogonal to said plane. 
     
     
         2 . The polishing pad of  claim 1 , wherein at least some of the polishing elements are made of one of: solid polyurethane, micro-porous polyurethane, polyacrylic, or PVA. 
     
     
         3 . The polishing pad of  claim 1 , wherein the guide layer is made of one of: polyester or polycarbonate. 
     
     
         4 . The polishing pad of  claim 1 , wherein the flexible under-layer is made of one of: silicone, natural rubber, styrene butadiene rubber, neoprene, or polyurethane. 
     
     
         5 . A method of making a polishing pad, comprising depositing a plurality of individual polishing elements into holes present in a sheet of a guide layer material and affixing to the guide layer a backing layer so as to maintain the polishing elements in a substantially orthogonal orientation with respect to a plane defined by the guide layer. 
     
     
         6 . The method of  claim 5 , further comprising taking up a composite formed by the guide layer, the backing layer and the polishing elements onto an uptake roller. 
     
     
         7 . The method of  claim 5 , wherein the backing layer is affixed to the guide layer by an adhesive. 
     
     
         8 . The method of  claim 5 , wherein the guide layer material is directed to a position at which the polishing elements are deposited into the holes by external means. 
     
     
         9 . The method of  claim 8 , wherein the holes are formed after the guide layer material is spooled off a feed roller. 
     
     
         10 . The method of  claim 8 , wherein the backing layer is directed to a second position at which it is affixed to the guide layer material by one or more guide rollers different than the guide rollers used to direct the guide layer material to the position at which the polishing elements are deposited into the holes.