Substrate processing method and apparatus

Abstract

There is provided a substrate processing method and apparatus which can measure and monitor thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in process conditions, and which can therefore stably provide a product of constant quality. A substrate processing method for processing a substrate having a metal and an insulating material exposed on its surface in such a manner that a film thickness of the metal, with an exposed surface of the metal as a reference plane, is selectively or preferentially changed, including measuring a change in the film thickness and/or a film property of the metal during and/or immediately after processing, and monitoring processing and adjusting processing conditions based on results of this measurement.

1 - 18 . (canceled) 
   
   
       19 . A substrate processing apparatus comprising:
 a plating unit for plating a substrate with a metal and an insulating material exposed on its surface in such a manner that a coating film is formed selectively on the exposed surface of the metal;   a sensor for measuring the film thickness and/or a film property of the coating film during and/or immediately after formation of the coating film; and   a control section for controlling the plating unit based on an output from the sensor.   
   
   
       20 - 21 . (canceled)