Addition of D2 to H2 to Detect and Calibrate Atomic Hydrogen Formed By Dissociative Electron attachment
Abstract
A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.
Claims
exact text as granted — not AI-modified1 - 21 . (canceled)
22 . An apparatus for dry fluxing metal surfaces of one or more components to be soldered by electron attachment, comprising:
a) a furnace capable of containing such components; b) a source of reducing gas mixture connected to said furnace wherein the reducing gas mixture comprises hydrogen and deuterium; c) an anode positioned in said furnace for supporting such components; d) a cathode adjacent said anode having a plurality of emission tips attached to a plate; e) a source of direct current attached to said anode and said cathode; and f) an outlet for the reducing gas mixture from said furnace.
23 . The apparatus of claim 22 wherein the outlet from the furnace has a detector for detecting molecules formed from said hydrogen and deuterium.
24 - 27 . (canceled)
28 . The apparatus of claim 22 wherein the reducing gas mixture further comprises an inert gas.Join the waitlist — get patent alerts
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