Multi-purpose panels with a modular edge

Abstract

A panel for use in constructing a mat or a road and method for same is provided. The panel can include a wafer having at least three sides operatively coupled to an edge having a complementary profile for overlapping and attaching to another edge coupled to another wafer. The edge can be attached to the wafer using a scarf joint or a mortise and tenon joint. The complementary profile can include a lap joint, a tapered lap joint, an S-shaped lap joint or a modified lap joint for use with fasteners for attaching two edges together.

1 . A panel, comprising:
 a) a wafer including at least three sides of which at least one side is configured to operatively couple to an edge;   b) an edge including a first end comprising a complementary profile for overlapping and attaching to another edge comprising the complementary profile, the edge comprising a second end configured for operatively coupling to the at least one side of the wafer; and   c) attachment means for operatively coupling the second end of the edge to the at least one side of the wafer.   
   
   
       2 . The panel as set forth in  claim 1  wherein the complementary profile is selected from the group consisting of a lap joint, a tapered lap joint, an S-shaped lap joint and a modified lap joint for use with at least one fastener. 
   
   
       3 . The panel as set forth in  claim 1  wherein the attachment means further comprises each of the at least one side of the wafer and the second end of the edge being configured to form a scarf joint when the edge and the wafer are attached together. 
   
   
       4 . The panel as set forth in  claim 1  wherein the attachment means further comprises a mortise and tenon joint. 
   
   
       5 . The panel as set forth in  claim 4  wherein the attachment means further comprises mortises disposed at least partially along both of the at least one side of the wafer and the second end of the edge, and a tenon configured for insertion into the mortises disposed on the edge and the wafer whereby the edge can be attached to the wafer. 
   
   
       6 . The panel as set forth in  claim 4  wherein the attachment means further comprises a mortise disposed at least partially along the at least one side of the wafer and the second end of the edge configured to form a tenon for insertion into the mortise whereby the edge can be attached to the wafer. 
   
   
       7 . A mat comprising two or more panels configured for attachment to each other, each panel comprising:
 a) a wafer comprising at least three sides of which at least one side is configured to operatively couple to an edge;   b) an edge comprising a first end further comprising a complementary profile for overlapping and attaching to another edge of a second panel comprising the complementary profile, the edge comprising a second end for operatively coupling to the at least one side of the wafer; and   c) attachment means for operatively coupling the second end of the edge to the at least one side of the wafer.   
   
   
       8 . The mat as set forth in  claim 7  wherein the complementary profile is selected from the group consisting of a lap joint, a tapered lap joint, an S-shaped lap joint and a modified lap joint for use with at least one fastener. 
   
   
       9 . The mat as set forth in  claim 7  wherein the attachment means further comprises each of the at least one side of the wafer and the second end of the edge being configured to form a scarf joint when the edge and the wafer are attached together. 
   
   
       10 . The mat as set forth in  claim 7  wherein the attachment means further comprises a mortise and tenon joint. 
   
   
       11 . The mat as set forth in  claim 10  wherein the attachment means further comprises mortises disposed at least partially along both of the at least one side of the wafer and the second end of the edge, and a tenon configured for insertion into the mortises disposed on the edge and the wafer whereby the edge can be attached to the wafer. 
   
   
       12 . The mat as set forth in  claim 10  wherein the attachment means further comprises a mortise disposed at least partially along the at least one side of the wafer and the second end of the edge is configured to form a tenon for insertion into the mortise whereby the edge can be attached to the wafer. 
   
   
       13 . A method for constructing a mat or a road comprising two or more panels, the method comprising the steps of:
 a) providing a first panel and a second panel, each panel comprising:
 i) a wafer comprising at least three sides of which at least one side in configured to operatively couple to an edge, 
 ii) an edge comprising a first end further comprising a complementary profile for overlapping and attaching to another edge comprising the complementary profile, the edge comprising a second end configured for operatively coupling to the at least one side of the wafer, and 
 iii) attachment means for operatively coupling the second end of the edge to the at least one side of the wafer; and 
   b) attaching the second panel to the first panel by overlapping the complementary profiles of the edges of the panels together whereby the panels can be attached to each other.   
   
   
       14 . The method as set forth in  claim 13  further comprising the step of attaching the first and second panels together with attachment means. 
   
   
       15 . The method as set forth in  claim 14  wherein the attachment means comprises one or more from the group consisting of nails, screws, bolt and nuts, mortises and tenons, rivets, welding, soldering, glue and hook and loop fasteners. 
   
   
       16 . The method as set forth in  claim 13  wherein the complementary profile is selected from the group consisting of a lap joint, a tapered lap joint, an S-shaped lap joint and a modified lap joint for use with at least one fastener. 
   
   
       17 . The method as set forth in  claim 13  wherein the attachment means further comprises each of the at least one side of the wafer and the second end of the edge being configured to form a scarf joint when the edge and the wafer are attached together. 
   
   
       18 . The method as set forth in  claim 13  wherein the attachment means further comprises a mortise and tenon joint. 
   
   
       19 . The method as set forth in  claim 18  wherein the attachment means further comprises mortises disposed at least partially along both of the at least one side of the wafer and the second end of the edge, and a tenon configured for insertion into the mortises disposed on the edge and the wafer whereby the edge can be attached to the wafer. 
   
   
       20 . The method as set forth in  claim 18  wherein the attachment means further comprises a mortise disposed at least partially along the at least one side of the wafer and the second end of the edge configured to form a tenon for insertion into the mortise whereby the edge can be attached to the wafer. 
   
   
       21 . The use of a panel for constructing a mat or a road, the panel comprising:
 a) a wafer comprising at least three sides of which at least one side in configured to operatively couple to an edge;   b) an edge comprising a first end further comprising a complementary profile for overlapping and attaching to another edge comprising the complementary profile, the edge comprising a second end configured for operatively coupling to the at least one side of the wafer; and   c) attachment means for operatively coupling the second end of the edge to the at least one side of the wafer.