Curable encapsulant composition and associated method

Abstract

An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition.

1 . A curable encapsulant composition, comprising:
 a mixture comprising a functionalized polymer, and a reactive monomer composition comprising at least one reactive monomer;   wherein the reactive monomer is selected from the group consisting of triallyloxytriazine, bis[[4-[(vinyloxy)methyl]cyclohexyl]methyl] terephthalate, biphenol dimethacrylate, bisphenol A dimethacrylate, 4-biphenyl methacrylate, cyclohexane dimethanol diacrylate, 1,5-dimethacryloyl naphthalene, sulfonyldiphenol dimethacrylate, tetramethyl bisphenol A dimethacrylate, tetramethyl biphenol dimethacrylate, and mixtures thereof; and   wherein the reactive monomer is present in the reactive monomer composition in an amount of greater than 20 weight percent based on the total weight of reactive monomer composition.   
     
     
         2 . The curable encapsulant composition of  claim 1 , wherein the functionalized polymer comprises a poly(arylene) ether. 
     
     
         3 . The curable encapsulant composition of  claim 2 , wherein the poly(arylene) ether comprises a capped poly(arylene ether). 
     
     
         4 . The curable encapsulant composition of  claim 1 , wherein the reactive monomer comprises triallyloxytriazine. 
     
     
         5 . The curable encapsulant composition of  claim 1 , wherein the reactive monomer comprises bis[[4-[(vinyloxy)methyl]cyclohexyl]methyl] terephthalate. 
     
     
         6 . The curable encapsulant composition of  claim 1 , wherein the reactive monomer comprises biphenol dimethacrylate, tetramethyl biphenol dimethacrylate, or a mixture thereof. 
     
     
         7 . The curable encapsulant composition of  claim 1 , wherein the reactive monomer comprises bisphenol A dimethacrylate, tetramethyl bisphenol A dimethacrylate, or a mixture thereof. 
     
     
         8 . The curable encapsulant composition of  claim 1 , wherein the reactive monomer comprises 4-biphenyl methacrylate. 
     
     
         9 . The curable encapsulant composition of  claim 1 , wherein the reactive monomer comprises cyclohexane dimethanol diacrylate. 
     
     
         10 . The curable encapsulant composition of  claim 1 , wherein the reactive monomer comprises 1,5-dimethacryloyl naphthalene. 
     
     
         11 . The curable encapsulant composition of  claim 1 , wherein the reactive monomer comprises sulfonyldiphenol dimethacrylate. 
     
     
         12 . The curable encapsulant composition of  claim 1 , wherein the reactive monomer composition has a melting point or a softening point in a range of 24 to 175 degrees Celsius. 
     
     
         13 . The curable encapsulant composition of  claim 1 , wherein the mixture is tack-free, solid, or both tack-free and solid at a temperature in a range of 25 to 50 degrees Celsius. 
     
     
         14 . The curable encapsulant composition of  claim 1 , further comprising a filler selected from the group consisting of fused silica, fumed silica, colloidal silica, alumina, boron nitride, titania, titanium dioxide, titanium diboride, talc, fly ash, calcium carbonate, carbon black, zinc oxide, and graphite. 
     
     
         15 . The curable encapsulant composition of  claim 1 , wherein the curable encapsulant composition has a spiral flow path length of 40.5 to 100 inches (103 to 254 centimeters) at 1 megaPascal and 150 degrees Celsius. 
     
     
         16 . The curable encapsulant composition of  claim 1 ,
 wherein the functionalized polymer comprises a capped poly(arylene ether);   wherein the functionalized polymer is present in an amount of 10 to 50 weight percent based on the total weight of the combination of the functionalized polymer and the reactive monomer composition;   wherein the reactive monomer is selected from the group consisting of cyclohexane dimethanol diacrylate, 4-biphenyl methacrylate, and mixtures thereof;   wherein the curable encapsulant composition further comprises a filler selected from the group consisting of fused silica, fumed silica, colloidal silica, alumina, boron nitride, titania, titanium dioxide, titanium diboride, talc, fly ash, calcium carbonate, carbon black, zinc oxide, and graphite; and   wherein the mixture is tack-free, solid, or both tack-free and solid at a temperature in a range of 25 to 50 degrees Celsius.   
     
     
         17 . A method of encapsulating at least a portion of an electronic or optical device, comprising:
 melting at least a portion of pellets or powder;
 wherein the portion comprises a mixture comprising a functionalized polymer and a reactive monomer composition; 
 wherein the reactive monomer composition comprises a reactive monomer selected from the group consisting of trialylloxytriazine, bis[[4-[(vinyloxy)methyl]cyclohexyl]methyl] terephthalate, biphenol dimethacrylate, bisphenol A dimethacrylate, 4-biphenyl methacrylate, cyclohexane dimethanol diacrylate, 1,5-dimethacryloyl naphthalene, sulfonyldiphenol dimethacrylate, tetramethyl bisphenol A dimethacrylate, tetramethyl biphenol dimethacrylate, and mixtures thereof; 
 wherein the reactive monomer is present in the reactive monomer composition in an amount in a range of greater than 20 weight percent based on the total weight of the reactive monomer composition; and 
 wherein the mixture is tack-free, solid, or both tack-free and solid at a temperature in a range of 25 to 50 degrees Celsius; and 
   flowing the molten portion into contact with the portion of the electronic or optical device.   
     
     
         18 . The method of  claim 17 , further comprising curing the molten portion to encapsulate the at least a portion of the electronic or optical device. 
     
     
         19 . The method of  claim 17 ,
 wherein the functionalized polymer comprises a capped poly(arylene ether);   wherein the functionalized polymer is present in an amount of 10 to 50 weight percent based on the total weight of the combination of the functionalized polymer and the reactive monomer composition;   wherein the reactive monomer is selected from the group consisting of cyclohexane dimethanol diacrylate, 4-biphenyl methacrylate, and mixtures thereof;   wherein the mixture further comprises a filler selected from the group consisting of fused silica, fumed silica, colloidal silica, alumina, boron nitride, titania, titanium dioxide, titanium diboride, talc, fly ash, calcium carbonate, carbon black, zinc oxide, and graphite; and   wherein the mixture is tack-free, solid, or both tack-free and solid at a temperature in a range of 25 to 50 degrees Celsius.