Halogen-free phosphorous epoxy resin composition

Abstract

The present invention relates to a halogen-free phosphorous epoxy resin composition, primarily used as an adhesive for the printed circuit board. The composition comprises a halogen-free phosphorous contained epoxy resin which reduces the addition amount of additional flame retardant; in order to offer flame retardancy while maintaining high flexibility of flexible printed circuit board.

1 . A type of phosphorus-containing halogen-free epoxy resin composition is used as an adhesive, and the composition comprises:
 a part of phosphorus-containing halogen-free epoxy resin composition;   a part of halogen-free resin;   a part of catalyst;   a part of elastomer;   and a part of filler;   Wherein said halogen-free phosphorus epoxy resin has the structure as shown in the following formula (I).   
     
       
         
         
             
             
         
       
       wherein A is 
     
     
       
         
         
             
             
         
       
     
     or a hydrogen, or a halogen-free alkyl group, or alkoxy group; R is the hydrogen, halogen-free substituted alkyl group or alkoxy group. 
   
   
       2 . A composition of  claim 1  comprises:
 5˜50 wt % part phosphorus-containing halogen-free epoxy resin;   5˜50 wt % part halogen-free resin;   5˜20 wt % part curing agent;   0.1˜1 wt % part catalyst;   10˜50 wt % part elastomer;   and 5 wt % part or more filler (considering adding an appended preferred ratios).   
   
   
       3 . A composition of  claim 1 , wherein said halogen-free resin is a halogen-free epoxy resin or halogen-free phenol formaldehyde resin. 
   
   
       4 . A composition of  claim 1 , wherein said curing agent includes diaminodiphenyl sulfone (DDS), dicyandiamide (DICY), adipic dihydrazide (ADH), and phenol-aldehyde resin or mixture thereof. 
   
   
       5 . A composition of  claim 1 , wherein said elastomer includes the carboxy terminated butadiene acrylonitrile (CTBN), amine terminated butadiene acrylonitrile (ATBN), polyamine, polyethylene terephthalate or mixture thereof. 
   
   
       6 . A composition of  claim 1 , wherein said 2-methyl imidazole (2MI), 2-ethyl-4-methyl imidazole (2E4MI), triphenyl phosphate (TPP), or mixture thereof. 
   
   
       7 . A composition of  claim 1 , wherein said filler includes a halogen-free flame retardant, inorganic powder, or mixture thereof. 
   
   
       8 . A composition of  claim 7 , wherein said halogen-free flame retardant includes ammonium polyphosphate (APP), melamine polyphosphate (MPP), melamine cyanurate (MC), Melamine Pyrophosphate or mixture thereof. 
   
   
       9 . A composition of  claim 1 , wherein said inorganic powder includes magnesium hydroxide, silica, magnesium silicate hydroxide, boron nitride (BN), or mixture thereof. 
   
   
       10 . A composition of  claim 1 , wherein said composition is used as an adhesive for printed circuit board. 
   
   
       11 . A composition of  claim 10 , wherein said printed circuit board is a flexible printed circuit board. 
   
   
       12 . The halogen-free phosphorous epoxy resin composition of the present invention comprises a halogen-free phosphorous epoxy resin, a halogen-free resin, a curing agent, a catalyst, an elastomer, and a filler; wherein said phosphorous epoxy resin has the structure as shown in the following formula:
 (I);   
     
       
         
         
             
             
         
       
     
     wherein A is 
     
       
         
         
             
             
         
       
     
     or a hydrogen, or an unsubstituted or halogen-free alkyl group, or alkoxy group; R is a hydrogen, unsubstituted or halogen-free substituted Hydroxyl, alkyl group or alkoxy group; After the halogen-free composition of the present invention is coated on a polyamide film and crimped with the copper foil at a high temperature through laminating and pressing under heat, it is provided with the following characteristics: flame retardancy reached the UL94VTM-0 standard, peel strength at 90° is greater than 0.6 kg/cm (IPC TM650 standard), MIT is greater than 800 times (JIS C6471 R=0.38), high temperature proof (Solder float at 260° C., 10 sec; IPC TM650), high temperature and damp proof (at 90° peel strength at 85% RH/85 24 hr is greater than 0.6 kg/cm), and resin flow property is smaller than 250 μm