Thermosetting Adhesive

Abstract

A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.

1 . A thermosetting adhesive comprising:
 a thermosetting insulating adhesive component; and   a photoradical generator which generates radicals due to irradiation of active energy rays.   
   
   
       2 . The thermosetting adhesive according to  claim 1 , wherein the photoradical generator is a benzyldimethylketal compound, an α-hydroxy ketone compound, a bisacylphosphine oxide compound, or an α-amino ketone compound. 
   
   
       3 . The thermosetting adhesive according to  claim 2 , wherein the benzyldimethylketal compound is 2,2-dimethoxy-1,2-diphenylethan-1-one. 
   
   
       4 . The thermosetting adhesive according to  claim 2 , wherein the α-hydroxy ketone compound is 1-hydroxy-cyclohexyl-phenyl ketone or 2-hydroxy-2-methyl-1-phenyl-propan-1-one. 
   
   
       5 . The thermosetting adhesive according to  claim 2 , wherein the bisacylphosphine oxide compound is bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. 
   
   
       6 . The thermosetting adhesive according to  claim 2 , wherein the α-amino ketone compound is 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one or 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one. 
   
   
       7 . The thermosetting adhesive according to  claim 1 , wherein an amount of the photoradical generator is in the range of from 0.001 wt. % to 20 wt. %. 
   
   
       8 . The thermosetting adhesive according to  claim 1 , wherein the thermosetting insulating adhesive component includes an epoxy resin and/or a phenoxy resin. 
   
   
       9 . The thermosetting adhesive according to  claim 1 , for use in connecting a substrate in which an IC or an electrode pattern is formed with a substrate in which another electrode pattern is formed. 
   
   
       10 . The thermosetting adhesive according to  claim 1 , further comprising conductive particles for anisotropic conductive adhesion. 
   
   
       11 . A repair method for enabling a substrate and/or an electronic component to be reused by separating the electronic component from the substrate of a connecting structure on which the substrate and the electronic component are connected by thermal compression-bonding with an adhesive, and removing the adhesive attached to the substrate and/or electronic component, comprising:
 using the thermosetting adhesive according to  claim 1  as an adhesive;   irradiating a cured matter of the thermosetting adhesive with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, to make the cured matter soluble or swellable in a predetermined solvent; and   removing the cured matter using the solvent.   
   
   
       12 . A repair method for enabling a substrate and/or an electronic component to be reused by separating the electronic component from the substrate of a connecting structure on which the substrate and the electronic component are connected by thermal compression-bonding with an adhesive, and removing the adhesive attached to the substrate and/or electronic component, comprising:
 using the thermosetting adhesive according to  claim 1  as an adhesive;   irradiating a cured matter of the thermosetting adhesive with active energy rays after the electronic component has been separated from the substrate, to make the cured matter soluble or swellable in a predetermined solvent; and   removing the cured matter using the solvent.   
   
   
       13 . The repair method according to  claim 12 , wherein, after the electronic component has been separated from the substrate, the predetermined solvent is brought into contact with the cured matter of the thermosetting adhesive, and then the cured matter is irradiated with the active energy rays. 
   
   
       14 . The repair method according to  claim 13 , wherein the solvent is a cation-generating salt solution or an acetamide solvent.