System And Method For Depositing A Seed Layer

Abstract

A method for depositing a seed layer for a controllable electric pathway on a substrate includes selectively dispensing a seed material from an inkjet material dispenser onto said substrate.

1 - 38 . (canceled) 
   
   
       39 . A system for depositing seed layers on a substrate comprising:
 a material reservoir containing seed material; and   an inkjet material dispenser fluidly coupled to said material reservoir;   wherein said inkjet material dispenser is configured to selectively dispense said seed material onto said substrate to aid in formation of a controllable electric pathway.   
   
   
       40 . The system of  claim 39 , wherein said seed material comprises one of a stannous chloride solution or a tin/palladium complex solution. 
   
   
       41 . The system of  claim 39 , wherein said inkjet material dispenser comprises one of a thermally actuated inkjet dispenser, a mechanically actuated inkjet dispenser, an electrostatically actuated inkjet dispenser, a magnetically actuated dispenser, a piezoelectrically actuated dispenser, or a continuous inkjet dispenser. 
   
   
       42 . The system of  claim 39 , further comprising a servo mechanism controllably coupled to said inkjet material dispenser. 
   
   
       43 . The system of  claim 42 , further comprising a computing device controllably coupled to said servo mechanism;
 wherein said computing device is configured to generate a graphical a seed pattern and convert said graphical seed pattern to a plurality of servo commands;   said servo commands being configured to controllably translate said inkjet material dispenser according to said graphical seed pattern.   
   
   
       44 . The system of  claim 39 , further comprising a substrate transport system disposed adjacent to said inkjet material dispenser. 
   
   
       45 . The system of  claim 44 , further comprising a plurality of baths associated with said substrate transport system. 
   
   
       46 . The system of  claim 45 , wherein said plurality of baths comprise:
 a rinsing bath including de-ionized water;   a palladium isolating bath including one of an accelerating solution or a palladium chloride solution; and   a zinc oxide plating solution including zinc nitrate (Zn(NO 3 ) 2 ) and dimethylamine borane (C 2 H 10 BN).   
   
   
       47 - 54 . (canceled)