Method of manufacturing semiconductor device having a heat sink with a bored portion

Abstract

A heatsink plate is to be fixed to a substrate with sufficient strength, so as to prevent the heatsink plate from being stripped off, to thereby secure reliability on the performance of the semiconductor chip. The heatsink plate has both the upper and lower surfaces of the fixing section sandwiched by an adhesive resin. Such structure provides an increased adhesion area between the heatsink plate and the upper surface of the substrate, thereby securing greater fixing strength compared with the conventional structure in which simply the lower surface of the heatsink plate and the upper surface of the substrate are adhered to each other. Accordingly, the heatsink plate can be fixed to the upper surface of substrate with greater strength.

1 . A method of manufacturing a semiconductor device including a heatsink plate fixed to a substrate on which a semiconductor chip is mounted, so as to cover said semiconductor chip, comprising:
 preparing said substrate on which said semiconductor chip is mounted, and said heatsink plate including one or more bored portions formed on a fixing surface thereof to be fixed to said substrate;   applying a resin to said substrate on which said semiconductor chip is mounted;   pressing said fixing surface, of said heatsink plate, against said resin applied to said substrate thereby filling said bored portion with said resin; and   hardening said resin filled in said bored portion thereby fixing said heatsink plate to said substrate.   
   
   
       2 . A method of manufacturing a semiconductor device including a heatsink plate fixed to a substrate on which a semiconductor chip is mounted, so as to cover said semiconductor chip, comprising:
 preparing said substrate on which said semiconductor chip is mounted, and said heatsink plate including one or more through holes formed so as to communicate between a fixing surface thereof to be fixed to said substrate and a surface opposite to said surface;   applying a first resin to said substrate on which said semiconductor chip is mounted;   pressing said fixing surface, of said heatsink plate, against said first resin applied to said substrate;   filling said through hole with a second resin;   applying a third resin on said opposite surface in a larger diameter than said through hole so as to cover said through hole; and   hardening said first to said third resins thereby fixing said heatsink plate to said substrate.   
   
   
       3 . The method according to  claim 2 , wherein a relationship of EB=EA and EB=EC is satisfied when EA, EB, and EC respectively represents the elastic modulus of said first resin, said second resin, and said third resin.