Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same

Abstract

Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.

1 . An alignment precision enhancement device of an electronic component process on a flexible substrate, comprising:
 a substrate holder for carrying said flexible substrate;   a press machine for completely sticking said flexible substrate on said substrate holder by a polymer tape; and   an unstressed cutting machine for performing an unstressed cut according to positions of a plural of alignment marks and along the width of said flexible substrate so as to separate said flexible substrate from said substrate holder.   
     
     
         2 . The device according to  claim 1 , wherein said substrate holder is made of glass, quartz, metal or ceramic. 
     
     
         3 . The device according to  claim 1 , wherein said flexible substrate is a polymer substrate, an organic and inorganic mixed substrate, a metal substrate or a glass substrate. 
     
     
         4 . The device according to  claim 1 , wherein said polymer tape is made of polymer or an organic/inorganic mixed polymer complex material.