Clip module and heat dissipation device having the same

Abstract

A clip module and a heat dissipation device having the same are disclosed, wherein the heat dissipation device is suitable to dissipate the heat for a heat source on a circuit board. The heat dissipation device includes a retention module, a heat sink and a clip module. The retention module is provided on the circuit board and around the heat source, and the heat sink is provided on the heat source. The clip module includes a body, a fastener fastened to the retention module and a pressing structure. The pressing structure includes a first triangle block and a second triangle block which is slidably provided on two adjacent surfaces of the first triangle block, and the fastener is pivotally provided at the second triangle block.

1 . A clip module which is suitable to cooperate with a retention module to fix a heat sink on a heat source, wherein the retention module has a first fastening part and a second fastening part, the clip module comprising:
 a body having a pressing part, a third fastening part and a connecting part, wherein the third fastening part and the connecting part are located at two ends of the pressing part, the pressing part is used to make the heat sink press against the heat source, and the third fastening part is used to be fastened at the first fastening part;   a fastener having a guiding part and a fourth fastening part, wherein the fourth fastening part is used to be fastened at the second fastening part; and   a pressing structure having a first triangle block and a second triangle block, wherein the first triangle block has a first lateral surface leaning against the connecting part, a second lateral surface, a third lateral surface and a guiding hole, and the second triangle block leans against the second lateral surface or the third lateral surface in a sliding mode, and the guiding part passes through the connecting part and the guiding hole and is pivotally provided at the second triangle block, and when the second triangle block slides to the third lateral surface from the second lateral surface, the guiding part slides from a first position on the second lateral surface and near the first lateral surface to a second position on the third lateral surface and away from the first lateral surface further to make the pressing structure apply force to the body.   
     
     
         2 . The clip module according to  claim 1 , wherein the guiding part is provided at the connecting part. 
     
     
         3 . The clip module according to  claim 1 , wherein the guiding hole extends from the first lateral surface to the second lateral surface and part of the third lateral surface. 
     
     
         4 . The clip module according to  claim 1 , wherein the guiding part is pivotally provided on a pivot of the second triangle block. 
     
     
         5 . A heat dissipation device which is suitable to dissipate the heat for a heat source on a circuit board, the heat dissipation device comprising:
 a retention module provided on the circuit board and around the heat source, wherein the retention module has a first fastening part and a second fastening part;   a heat sink provided on the heat source; and   a clip module which is provided across the heat sink and is fastened at the retention module, the clip module comprising:
 a body having a pressing part, a third fastening part and a connecting part, wherein the third fastening part and the connecting part are located on the pressing part, the pressing part is used to make the heat sink press against the heat source, and the third fastening part is used to be fastened at the first fastening part; 
 a fastener having a guiding part and a fourth fastening part, wherein the fourth fastening part is used to be fastened at the second fastening part; and 
 a pressing structure having a first triangle block and a second triangle block, wherein the first triangle block has a first lateral surface leaning against the connecting part, a second lateral surface, a third lateral surface and a guiding hole, and the second triangle block leans against the second lateral surface or the third lateral surface in a sliding mode, and the guiding part passes through the connecting part and the guiding hole and is pivotally provided at a pivotal connecting end of the second triangle block, and when the second triangle block slides to the third lateral surface from the second lateral surface, the pivotal connecting end slides from a first position on the second lateral surface and near the first lateral surface to a second position on the third lateral surface and away from the first lateral surface further to make the pressing structure apply force to the body. 
   
     
     
         6 . The heat dissipation device according to  claim 5 , wherein the guiding part and the fourth fastening part are provided at the connecting part, respectively. 
     
     
         7 . The heat dissipation device according to  claim 5 , wherein the guiding hole extends from the first lateral surface to the second lateral surface and part of the third lateral surface. 
     
     
         8 . The heat dissipation device according to  claim 5 , wherein the guiding part is pivotally provided on a pivot of the second triangle block.