US2009035173A1PendingUtilityA1
Electrically Conductive Material
Est. expiryAug 3, 2027(~1.1 yrs left)· nominal 20-yr term from priority
C22C 9/00
45
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
An electrically conductive material includes: a supersaturated solid solution of a polycrystalline copper alloy having a composition represented by the formula: Cu 100-x-y M x N y ; wherein x and y are atomic ratios; wherein 0<x≦2.0 and 0≦y≦2.0; wherein M is selected from Ru, Re, Ho, and combinations thereof; and wherein the supersaturated solid solution includes M precipitates formed at grain boundaries of the polycrystalline copper alloy when y is equal to zero, and includes M precipitates and MN particles formed at the grain boundaries of the polycrystalline copper alloy when y is not zero.
Claims
exact text as granted — not AI-modified1 . An electrically conductive material comprising:
a supersaturated solid solution of a polycrystalline copper alloy having a composition represented by the formula:
Cu 100-x-y M x N y ;
wherein x and y are atomic ratios; wherein 0<x≦2.0 and 0≦y≦2.0; wherein M is selected from the group consisting of Ru, Re, Ho, and combinations thereof.
2 . The electrically conductive material of claim 1 , wherein said supersaturated solid solution includes M precipitates formed at grain boundaries of said polycrystalline copper alloy when y is equal to zero, and includes M precipitates and MN particles formed at the grain boundaries of said polycrystalline copper alloy when y is not zero.
3 . The electrically conductive material of claim 1 , wherein said polycrystalline copper alloy is an annealed material that is annealed at a temperature ranging from 200° C. to 750° C.
4 . The electrically conductive material of claim 1 , wherein said polycrystalline copper alloy has a crystal grain size ranging from 30 nm to 150 nm.
5 . The electrically conductive material of claim 1 , wherein M is Ru, 0<x≦2.0, and y=0.
6 . The electrically conductive material of claim 5 , wherein said polycrystalline copper alloy is an annealed material that is annealed at a temperature ranging from 300° C. to 580° C.
7 . The electrically conductive material of claim 1 , wherein M is Ru, 0<x≦2.0, and 0.01≦y≦2.0.
8 . The electrically conductive material of claim 7 , wherein said polycrystalline copper alloy is an annealed material that is annealed at a temperature ranging from 300° C. to 680° C.
9 . The electrically conductive material of claim 1 , wherein M is Re, 0<x≦2.0, and y=0.
10 . The electrically conductive material of claim 9 , wherein said polycrystalline copper alloy is an annealed material that is annealed at a temperature ranging from 300° C. to 560° C.
11 . The electrically conductive material of claim 1 , wherein M is Re, 0<x≦2.0, and 0.01≦y≦2.0.
12 . The electrically conductive material of claim 11 , wherein said polycrystalline copper alloy is an annealed material that is annealed at a temperature ranging from 300° C. to 730° C.
13 . The electrically conductive material of claim 1 , wherein M is Ho, 0<x≦2.0, and 0.01≦y≦2.0.
14 . The electrically conductive material of claim 13 , wherein said polycrystalline copper alloy is an annealed material that is annealed at a temperature ranging from 300° C. to 660° C.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.