Cmp pad dresser and cmp apparatus using the same

Abstract

A CMP pad dresser for dressing a polishing pad of a CMP apparatus is provided with a dressing pad having abrasive grains, a purified water supply unit provided to an external periphery of the dressing pad, and a drive mechanism for sliding the dressing pad in a radial direction of the polishing pad. The dressing pad is slidable to the outer side of the polishing pad. The purified water supply unit supply purified water at a prescribed pressure so that particles of abrasive grains that are dislodged from the dresser accumulate in the dressing pad.

1 . A CMP pad dresser for dressing a polishing pad of a CMP apparatus, comprising:
 a dressing pad having abrasive grains; and   a purified water supply unit provided to an external periphery of the dressing pad.   
   
   
       2 . The CMP pad dresser as claimed in  claim 1 , wherein the purified water supply unit supplies purified water at a prescribed pressure so that particles of abrasive grains that are dislodged from the dresser accumulate in the dressing pad. 
   
   
       3 . The CMP pad dresser as claimed in  claim 1 , further comprising a drive mechanism for sliding the dressing pad in a radial direction of the polishing pad, wherein the dressing pad is slidable to the outer side of the polishing pad. 
   
   
       4 . The CMP pad dresser as claimed in  claim 1 , wherein the purified water supply unit includes a plurality of nozzles for spraying purified water perpendicularly to the surface of the polishing pad. 
   
   
       5 . A CMP apparatus, comprising:
 a polishing pad; and   a CMP pad dresser for dressing the polishing pad, wherein   the CMP pad dresser includes a dressing pad having abrasive grains and a purified water supply unit provided to the external periphery of the dressing pad, and   the purified water supply unit for supplying purified water at a prescribed pressure so that particles of abrasive grains that have dislodged from the dresser accumulate in the dressing pad.   
   
   
       6 . The CMP apparatus as claimed in  claim 5 , wherein the CMP pad dresser further includes a drive mechanism for sliding the dressing pad in a radial direction of the polishing pad, and the dressing pad is slidable to the outer side of the polishing pad. 
   
   
       7 . The CMP apparatus as claimed in  claim 5 , wherein the purified water supply unit includes a plurality of nozzles for spraying purified water perpendicularly to the surface of the polishing pad.