US2009039370A1PendingUtilityA1
Semiconductor light emitting device
Est. expiryAug 9, 2027(~1.1 yrs left)· nominal 20-yr term from priority
H10H 20/82H10H 20/819H10H 20/821
52
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Claims
Abstract
A semiconductor light emitting device and a method of manufacturing the semiconductor light emitting device are provided. The semiconductor light emitting device comprises a substrate having a top surface that is curved to protrude, and a light emitting structure that is curved to protrude on the substrate and comprises an active layer.
Claims
exact text as granted — not AI-modified1 . A semiconductor light emitting device comprising:
a substrate comprising a top surface curved to protrude; and a light emitting structure curved to protrude on the substrate and comprises an active layer.
2 . The semiconductor light emitting device according to claim 1 , wherein the light emitting structure is curved with a same curvature as the substrate.
3 . The semiconductor light emitting device according to claim 1 , wherein the top surface of the substrate protrudes with a predetermined curvature from both opposite lowest points to a central highest point.
4 . The semiconductor light emitting device according to claim 3 , wherein the lowest points of the top surface of the substrate are formed on at least two sides.
5 . The semiconductor light emitting device according to claim 1 , wherein a thickness of the substrate at a highest point of the top surface is greater than a thickness of the substrate at a lowest point of the top surface by 1-100 μm.
6 . The semiconductor light emitting device according to claim 1 , wherein the top surface of the substrate is provided with a protrusion/groove pattern.
7 . The semiconductor light emitting device according to claim 6 , wherein the protrusion/groove pattern comprises at least one of a plurality of cone-shaped protrusions, a plurality of hemi-circular-shape protrusions, a plurality of convex lens-shaped protrusions, and a plurality of polygonal-shaped protrusions.
8 . The semiconductor light emitting device according to claim 1 , wherein the light emitting structure comprises at least one conductive type semiconductor layer on and under the active layer.
9 . The semiconductor light emitting device according to claim 1 , comprising at least one of a buffer layer and an undoped semiconductor layer, which is curved to protrude between the substrate and the light emitting structure.
10 . A semiconductor light emitting device comprising:
a first conductive type semiconductor layer curved in a first direction; an active layer curved in the first direction on the first conductive type semiconductor layer; and a second conductive type semiconductor layer curved in the first direction on the active layer.
11 . The semiconductor light emitting device according to claim 10 , wherein the first conductive type semiconductor layer, the active layer, and the second conductive type semiconductor layer are curved to protrude upward.
12 . The semiconductor light emitting device according to claim 10 , wherein the first conductive type semiconductor layer, the active layer, and the second conductive type semiconductor layer are curved to protrude downward.
13 . The semiconductor light emitting device according to claim 10 , wherein the first conductive type semiconductor layer, the active layer, and the second conductive type semiconductor layer are curved with a same curvature.
14 . The semiconductor light emitting device according to claim 10 , comprising at least one of a buffer layer, an undoped semiconductor layer, and a substrate that are curved to protrude upward under the first conductive type semiconductor layer.
15 . The semiconductor light emitting device according to claim 10 , wherein at least one of the layers that are curved is provided with a protrusion/groove pattern.
16 . The semiconductor light emitting device according to claim 10 , comprising at least one of an N-type semiconductor layer, a transparent electrode layer, a reflective electrode layer, and a conductive substrate that are formed on the second conductive type semiconductor layer and curved to protrude in the first direction.
17 . The semiconductor light emitting device according to claim 14 , wherein the substrate comprises at least one of sapphire (Al 2 O 3 ), SiC, Si, GaAs, GaN, ZnO, Si, GaP, InP, and Ge, and a highest point of the substrate is higher than a lowest point by 1-100 μm.
18 . A method of manufacturing a semiconductor light emitting device, the method comprising:
forming a substrate comprising a top surface curved to protrude; forming a semiconductor layer comprising a light emitting structure on the top surface of the substrate such that the semiconductor layer is curved to protrude.
19 . The method according to claim 18 , wherein the semiconductor layer is formed with a same curvature as the top surface of the substrate.
20 . The method according to claim 18 , wherein the top surface of the substrate comprises a protrusion/groove pattern.Join the waitlist — get patent alerts
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