US2009039439A1PendingUtilityA1

Integration Scheme for Dual Work Function Metal Gates

Assignee: TEXAS INSTRUMENTS INCPriority: Mar 30, 2007Filed: Oct 21, 2008Published: Feb 12, 2009
Est. expiryMar 30, 2027(~0.7 yrs left)· nominal 20-yr term from priority
H10D 64/0132H10D 30/601H10D 30/0227H10D 64/021H10D 64/017H10D 30/0212H10D 84/0177H10D 84/038
50
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Claims

Abstract

A method for making PMOS and NMOS transistors 60, 70 on a semiconductor substrate includes having a gate hardmask over the gate electrode layer during the formation of transistor source/drain regions. The method includes an independent work function adjustment process that implants Group IIIa series dopants into a gate polysilicon layer of a PMOS transistor and implants Lanthanide series dopants into a gate polysilicon layer of NMOS.

Claims

exact text as granted — not AI-modified
1 - 49 . (canceled) 
   
   
       50 . An NMOS transistor, comprising:
 a semiconductor substrate;   a gate dielectric coupled to said semiconductor substrate;   a fully silicided gate electrode coupled to said gate dielectric; and   source/drain regions located within said semiconductor substrate;   wherein said fully silicided gate electrode of said NMOS transistor includes a lanthanide series dopant.   
   
   
       51 . The NMOS transistor of  claim 50  wherein said fully silicided gate electrode also include an As dopant. 
   
   
       52 . The NMOS transistor of  claim 50  wherein said lanthanide series dopant is Yb. 
   
   
       53 . The NMOS transistor of  claim 50  wherein said gate dielectric includes a lanthanide series dopant. 
   
   
       54 . The NMOS transistor of  claim 53  wherein said lanthanide series dopant is Yb. 
   
   
       55 . A PMOS transistor, comprising:
 a semiconductor substrate;   a gate dielectric coupled to said semiconductor substrate;   a fully silicided gate electrode coupled to said gate dielectric;   source/drain regions located within said semiconductor substrate;   wherein said fully silicided gate electrode of said PMOS transistor includes a Group IIIa dopant.   
   
   
       56 . The PMOS transistor of  claim 55  wherein said fully silicided gate electrode also includes oxygen. 
   
   
       57 . The PMOS transistor of  claim 55  wherein said Group IIIa dopant is Ga. 
   
   
       58 . The PMOS transistor of  claim 55  wherein said gate dielectric includes a Group IIIa dopant. 
   
   
       59 . The PMOS transistor of  claim 58  wherein said Group IIIa dopant is Ga.

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