Pattern forming method and pattern forming apparatus

Abstract

According to an aspect of the present invention, there is provided a pattern forming apparatus in which a mold having a pattern is brought into contact with an imprinting material on a substrate to transfer the pattern, the apparatus including: a holding part configured to hold the mold; a moving part configured to move the holding part so that the mold is brought into contact with the imprinting material on the substrate and that the mold is removed therefrom; and a control part configured to control so that at least one of conditions of removing the mold can be changed based on conditions of the pattern formed in the mold, the conditions including a rate and an angle of removing the mold.

1 . A pattern forming apparatus in which a mold having a pattern formed thereon is brought into contact with an imprinting material on a process surface of a substrate to transfer the pattern, the apparatus comprising:
 a holding part configured to hold the mold;   a moving part configured to move the holding part in such a way that the mold is brought into contact with the imprinting material on the substrate, or the mold is removed therefrom; and   a control part configured to conduct control in such a way that at least one of conditions of removing the mold can be changed based on conditions of the pattern formed in the mold, the conditions including a rate of removing the mold of the moving part and an angle of removing the mold between the mold and the substrate in removing the mold.   
     
     
         2 . The pattern forming apparatus according to  claim 1 ,
 wherein the control part changes at least one of the conditions of removing the mold for individual shots or the individual substrates.   
     
     
         3 . The pattern forming apparatus according to  claim 1 ,
 wherein the control part further changes a temperature of the substrate as the condition of removing the mold.   
     
     
         4 . A pattern forming method in which a mold having a pattern formed thereon is brought into contact with an imprinting material on a process surface of a substrate to transfer the pattern, the method comprising:
 changing at least one of conditions of removing the mold for imprinting in moving the mold in such a way that the mold is removed from the substrate for testing, the conditions including a rate of removing the mold and an angle of removing the mold between the mold and the substrate;   checking a defect on the imprinted substrate and inspecting a relation between the number of defects and the conditions of removing mold to set an optimum condition of removing the mold; and   imprinting the pattern on the substrate for a product in accordance with the optimum condition of removing the mold.   
     
     
         5 . The pattern forming method according to  claim 4 ,
 wherein, when imprinting the substrate for testing, at least one of the conditions of removing the mold is changed for individual shots or the individual substrates.