Packaging method involving rearrangement of dice

Abstract

A packaging method is disclosed that comprises attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate. A polymer material is formed over at least a portion of both the substrate and the plurality of dice and a molding apparatus is used on the substrate to force the polymer material to substantially fill around the plurality of dice. The molding apparatus is removed to expose a surface of the polymer material and a plurality of cutting streets is formed on an exposed surface of the polymer material. The substrate is removed to expose the active surface of the plurality of dice

1 . A packaging method, comprising:
 attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate;   forming a polymer material over at least a portion of both the substrate and the plurality of dice;   using a molding apparatus on the substrate to force the polymer material to substantially fill around the plurality of dice;   removing the molding apparatus to expose a surface of the polymer material;   forming a plurality of cutting streets on an exposed surface of the polymer material; and   removing the substrate to expose the active surface of the plurality of dice.   
     
     
         2 . The packaging method of  claim 1  further comprising curing the polymer material by baking prior to removing the molding apparatus. 
     
     
         3 . The packaging method of  claim 1  wherein a depth of the plurality of cutting streets is selected to be about 25 micrometers. 
     
     
         4 . The packaging method of  claim 1  wherein a width of the plurality of cutting streets is selected to be from 5 micrometers to 25 micrometers. 
     
     
         5 . The packaging method of  claim 1  further comprising electrically coupling a plurality of electrically connecting devices to the plurality of bonding pads. 
     
     
         6 . The packaging method of  claim 5  wherein the plurality of electrically connecting devices are formed by steps comprising:
 forming a plurality of elongated metal lines, each of the plurality of elongated metal lines having a first end electrically coupled to one of the plurality of bonding pads; and   forming a plurality of conductive elements on a second end of each the plurality of elongated metal lines.   
     
     
         7 . The packaging method of  claim 1  wherein at least a portion of the plurality of dice is selected to be a flip-chip device. 
     
     
         8 . A packaging method, comprising:
 attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate;   using a molding apparatus on the substrate to form a space;   injecting a polymer material into the space to substantially fill around the plurality of dice;   removing the molding apparatus to expose a surface of the polymer material;   forming a plurality of cutting streets on an exposed surface of the polymer material; and   removing the substrate to expose the plurality of bonding pads on the active surface of each of the plurality of dice to complete a package structure.   
     
     
         9 . The packaging method of  claim 8  further comprising curing the polymer material by baking prior to removing the molding apparatus. 
     
     
         10 . The packaging method of  claim 8  wherein the adhesive layer is selected to be comprised of an elastic material. 
     
     
         11 . The packaging method of  claim 8  wherein at least a portion of the plurality of dice is selected to be flip-chip devices. 
     
     
         12 . A packaging method, comprising:
 attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate, the adhesive layer having a plurality of ribs disposed thereon;   forming a polymer material over at least portions of both the substrate and the plurality of dice;   using a molding apparatus on the substrate to force the polymer material to substantially fill around the plurality of dice;   removing the molding apparatus to expose a surface of the polymer material; and   removing the substrate to expose the active surface of the plurality of dice and a plurality of slots on the polymer material.   
     
     
         13 . The packaging method of  claim 12  wherein the adhesive layer is selected to be comprised of an elastic material. 
     
     
         14 . The packaging method of  claim 12  further comprising placing each of the plurality of dice so as to be separated, one from another, by select ones of the plurality of ribs. 
     
     
         15 . The packaging method of  claim 12  wherein at least a portion of the plurality of dice is selected to be flip-chip devices. 
     
     
         16 . A packaging method, comprising:
 attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate, the adhesive layer having a plurality of ribs disposed thereon;   using a molding apparatus on the substrate to form a space;   injecting a polymer material into the space to fill substantially around the plurality of dice;   removing the molding apparatus to expose a surface of the polymer material; and   removing the substrate to expose the active surface of the plurality of dice and a plurality of slots on the polymer material.   
     
     
         17 . The packaging method of  claim 16  wherein the adhesive layer is selected to be comprised of an elastic material. 
     
     
         18 . The packaging method of  claim 16  wherein at least a portion of the plurality of dice is selected to be flip-chip devices. 
     
     
         19 . A packaging method, comprising:
 attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate;   forming a polymer material over at least a portion of both the substrate and the plurality of dice;   using a molding apparatus on the substrate to force the polymer material to substantially fill around the plurality of dice, the molding apparatus having a first plurality of ribs formed thereon;   removing the molding apparatus to expose a surface of the polymer material and a plurality of slots formed therein; and   removing the substrate to expose the active surface of the plurality of dice.   
     
     
         20 . The packaging method of  claim 19  further comprising selecting the adhesive layer to have a second plurality of ribs. 
     
     
         21 . The packaging method according to  claim 19 , wherein the adhesive layer selected to be comprised of an elastic material. 
     
     
         22 . The packaging method of  claim 19  wherein at least a portion of the plurality of dice is selected to be flip-chip devices. 
     
     
         23 . A packaging method, comprising:
 attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate;   using a molding apparatus on the substrate to form a space, the molding apparatus having a first plurality of ribs formed thereon;   injecting a polymer material into the space to substantially fill around the plurality of dice;   removing the substrate to expose the active surface of each of the plurality of dice and a plurality of slots formed on the polymer material; and   removing the substrate to expose the active surface of the plurality of dice.   
     
     
         24 . The packaging method of  claim 23  further comprising selecting the adhesive layer to have a second plurality of ribs. 
     
     
         25 . The packaging method of  claim 23  wherein the adhesive layer is selected to be comprised of an elastic material. 
     
     
         26 . The packaging method of  claim 23  wherein at least a portion of the plurality of dice is selected to be flip-chip devices. 
     
     
         27 . A package structure formed by a packaging method of dice rearrangement, wherein the packaging method comprises:
 attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate;   using a molding apparatus on the substrate to form a space, the molding apparatus having a plurality of ribs formed thereon;   injecting a polymer material into the space to substantially fill around the plurality of dice; and   removing the substrate to expose the active surface of each of the dice and a plurality of slots formed on the polymer material, the package structure being characterized by exposed portions of the polymer material having circular-arc blunt angles of exposed portions of the plurality of dice.   
     
     
         28 . The packaging method of  claim 27  wherein at least a portion of the plurality of dice is selected to be flip-chip devices.