Dissipating Module Structure for Heat Generating Device

Abstract

The invention is to provide a heat dissipating module structure for a heat generating device. The heat dissipating module structure according to a preferred embodiment of the invention includes a heat-conducting device, a carrier, and a heat-conducting material. The first end of the heat-conducting device is inserted into the bore such that the top of the first end of the heating-conducting device is aligned with or close to the upper surface of the carrier. The heat-conducting material surrounds the upper surface of the carrier such that the heat-conducting material together with the upper surface provides a supporting plane. The heat generating device is to be mounted on the supporting plane. Moreover, the heat generated from the heat generating device is conducted from the first end of the heat-conducting device to the second end of the heat-conducting device.

1 . A heat dissipating module structure for a heat generating device, the heat dissipating module structure comprising:
 a heat-conducting device having a first end and a second end;   a carrier having an upper surface, a bottom surface and a hollow bore, the first end of the heat-conducting device being inserted into the hollow bore and the top of the first end of the heat-conducting device is disposed near or aligned with the upper surface of the carrier; and   a heat-conducting material surrounding the upper surface of the carrier such that the heat-conducting material together with the upper surface of the carrier provides a supporting plane;   whereby when the heat generating device is mounted on the supporting plane, the heat generated from the heat generating device is conducted from the first end of the heat-conducting device to the second end of the heating-conducting device.   
   
   
       2 . The heat dissipating module structure of  claim 1 , wherein the top of the first end of the heat-conducting device is aligned with the upper surface of the carrier. 
   
   
       3 . The heat dissipating module structure of  claim 2 , wherein the top of the first end of the heat-conducting device is disposed outside the bore, and then grinded so that the first end of the heat-conducting device is aligned with the upper surface of the carrier. 
   
   
       4 . The heat dissipating module structure of  claim 1 , wherein a distance exists between the upper surface of the carrier and the top of the first end of the heat-conducting device. 
   
   
       5 . The heat dissipating module structure of  claim 1 , wherein the carrier is formed of a metal material, a ceramic material or a polymer material. 
   
   
       6 . The heat dissipating module structure of  claim 1 , wherein the heat conducting material is a heat-conducting paste, the heat-conducting paste fills up the residual space in the bore, and then it is cured. 
   
   
       7 . The heat dissipating module structure of  claim 1 , wherein the heat-conducting paste is one selected from the group consisting of a solder paste, a silver paste, copper paste, a paste material containing metal particles and a paste material containing ceramic particles. 
   
   
       8 . The heat dissipating module structure of  claim 1 , wherein the heat-conducting device is a heat pipe or a cylinder device formed of a material with high heat conductivity. 
   
   
       9 . The heat dissipating module structure of  claim 1 , further comprising at least one heat-dissipating fin mounted on a periphery of the heat-conducting device. 
   
   
       10 . The heat dissipating module structure of  claim 1 , further comprising a heat sink mounted on the second end of the heat-conducting device. 
   
   
       11 . A heat dissipating module structure for a heat generating device, the heat dissipating module structure comprising:
 a heat-conducting device having a first end and a second end;   a carrier having an upper surface, a bottom surface and a groove, the groove formed on the bottom surface and the first end of the heat-conducting device being disposed into the groove; and   a heat-conducting material, filling up a residual space between the first end of the heat-conducting device and the groove;   whereby when the heat generating device is mounted on the upper surface of the carrier, the heat generated from the heat generating device is conducted from the carrier through the heat-conducting material and the first end of the heat-conducting device to the second end of the heating-conducting device.   
   
   
       12 . The heat dissipating module structure of  claim 11 , wherein the outer diameter of the first end of the heat-conducting device is substantially equal to the depth of the groove. 
   
   
       13 . The heat dissipating module structure of  claim 11 , wherein the outer diameter of the first end of the heat-conducting device is less than the depth of the groove. 
   
   
       14 . The heat dissipating module structure of  claim 11 , wherein the outer diameter of the first end of the heat-conducting device is larger than the depth of the groove. 
   
   
       15 . The heat dissipating module structure of  claim 11 , wherein the carrier is formed of a metal material or a ceramic material. 
   
   
       16 . The heat dissipating module structure of  claim 11 , wherein the heat-conducting material is a heat-conducting paste, the heat-conducting paste fills up the residual space in the groove and then is cured. 
   
   
       17 . The heat dissipating module structure of  claim 16 , wherein the heat-conducting paste is one selected from the group consisting of a solder paste, a silver paste, copper paste, a paste material containing metal particles and a paste material containing ceramic particles. 
   
   
       18 . The heat dissipating module structure of  claim 11 , wherein the heat-conducting device is a heat pipe or a cylinder device formed of a material with high heat conductivity. 
   
   
       19 . The heat dissipating module structure of  claim 11 , further comprising at least one heat-dissipating fin mounted on a periphery of the heat-conducting device. 
   
   
       20 . The heat dissipating module structure of  claim 11 , further comprising a heat sink mounted on the second end of the heat-conducting device.