Vibration isolators for printed wiring boards

Abstract

A vibration isolator device for printed wiring boards. An example vibration isolator device includes a solder tab with an elastomeric material that is adhesively attached to a first side of the solder tab. The second side of the solder tab is attached to a printed wiring board. Solder paste is pre-applied to the printed wiring board prior to attachment of the vibration isolator device. The solder tab has a U-shaped cross section.

1 . An isolator apparatus comprising:
 a solder tab; and   an elastomeric material adhesively attached to a first side of the solder tab,   wherein a second side of the solder tab is attached to a support structure.   
   
   
       2 . The apparatus of  claim 1 , further comprising a solder material positioned between the solder tab and the support structure. 
   
   
       3 . The apparatus of  claim 1 , wherein the solder tab has a U-shaped cross section. 
   
   
       4 . The apparatus of  claim 1 , wherein the solder tab is a solderable material. 
   
   
       5 . The apparatus of  claim 1 , wherein the solder tab and elastomeric material are extracted from a linear extension of a plurality of solder tabs with attached elastomeric material. 
   
   
       6 . The apparatus of  claim 5 , wherein the linear extension of a plurality of solder tabs with attached elastomeric material is provided on a reel. 
   
   
       7 . The apparatus of  claim 5 , wherein the solder tabs are placed in desired positions on the support structure using an automated pick and place machine. 
   
   
       8 . The apparatus of  claim 1 , wherein the support structure is a printed wiring board. 
   
   
       9 . An isolator system comprising:
 one or more isolator devices comprising:
 a solder tab; and 
 an elastomeric material adhesively attached to a first side of the solder tab; 
   a support structure; and   a package,   wherein a second side of each solder tab is attached to a support structure and the support structure is mounted within the package such that only the elastomeric material makes contact with the package.   
   
   
       10 . The apparatus of  claim 9 , wherein the support structure is a printed wiring board. 
   
   
       11 . The system of  claim 10 , wherein the printed wiring board comprises a receiving groove located on one side, the groove configured to receive at least a portion of the elastomeric material. 
   
   
       12 . The system of  claim 10 , wherein the one or more isolator devices are positioned on at least one of an edge or side of the printed wiring board based on center of gravity of the printed wiring board.