Method for producing a partially shaped electrically conductive structure

Abstract

There is described a process for the production of a partially shaped electrically conductive structure on a carrier substrate ( 16 ), wherein it is provided that a latent magnetic image of the graphic form of the electrically conductive structure, which latent magnetic image is formed from magnetic image points ( 11 m ) and non-magnetic image points, is produced from a digital data set which defines the graphic form of the electrically conductive structure on a magnetisable printing form ( 11 ), and that by means of the printing form ( 11 ) magnetic particles having an electrically conductive surface, which are attracted by the magnetic image points are arranged by the lateral magnetic image to afford the graphic form of the electrically conductive structure on the carrier substrate ( 16 ) and are fixed there. A multi-layer body produced with that process is further described.

1 . A process for the production of a partially shaped electrically conductive structure on a carrier substrate, wherein
 a latent magnetic image of the graphic form of the electrically conductive structure, which latent magnetic image is formed from magnetic image points and non-magnetic image points, is produced from a digital data set which defines the graphic form of the electrically conductive structure on a magnetisable printing form, and wherein, by means of the printing form, magnetic particles having an electrically conductive surface, which are attracted by the magnetic image points, are arranged by the latent magnetic image to afford the graphic form of the electrically conductive structure on the carrier substrate and are fixed there, and wherein an electrically conductive layer is galvanically applied to the magnetic particles.   
   
   
       2 . A process as set forth in  claim 1 , wherein magnetic particles of a diameter of between 2 μm and 10 μm are used. 
   
   
       3 . (canceled) 
   
   
       4 . A process as set forth in  claim 1 , wherein the magnetic particles are connected together by means of a first electrically conductive layer which is applied in the form of a metallic layer galvanically without external current using a reducing agent 
   
   
       5 . A process as set forth in  claim 4  wherein a second electrically conductive layer is galvanically deposited on the magnetic particles or the first electrically conductive layer. 
   
   
       6 . A process as set forth in  claim 1 , wherein the carrier substrate is coated prior to the application of the magnetic particles with a primer. 
   
   
       7 . A process as set forth in  claim 1 , wherein the magnetic particles are applied in the form of powder. 
   
   
       8 . A process as set forth in  claim 1 , wherein the magnetic particles are applied in the form of a disperse phase of a dispersion, wherein the proportion of the disperse phase ( 14   b ) to the dispersion ( 14   d ) is set to between 2 and 10% by weight. 
   
   
       9 . A process as set forth in  claim 6 , wherein a dispersing agent is used, which causes initial dissolution of the primer. 
   
   
       10 . A process as set forth in  claim 6 , wherein the magnetic particles are fixed on the carrier substrate by removal of the solvent from the primer and/or the dispersing agent. 
   
   
       11 . A process as set forth in  claim 6 , wherein the magnetic particles are fixed on the carrier substrate by melting of the primer and/or the dispersing agent. 
   
   
       12 . A process as set forth in  claim 6 , wherein the magnetic particles are fixed on the carrier substrate by hardening of the primer and/or the dispersing agent by UV radiation or thermally. 
   
   
       13 . A process as set forth in  claim 6 , wherein the primer and/or the dispersing agent forms or form an adhesion layer with a layer thickness which is between 0.5 times and 1.5 times the mean diameter of the magnetic particles. 
   
   
       14 . A process as set forth in  claim 1 , wherein the upper portions of the magnetic particles are exposed prior to the application of the first electrically conductive layer and/or the second electrically conductive layer. 
   
   
       15 . A process as set forth in  claim 14 , wherein to expose the upper portions of the magnetic particles, a solvent is used, which provides for initial dissolution of the primer and/or the dispersing agent. 
   
   
       16 . A process as set forth in  claim 14 , wherein the upper portions of the magnetic particles are exposed by partial thermal removal of the primer and/or the dispersing agent. 
   
   
       17 . A process as set forth in  claim 1 , wherein the magnetic particles are applied to the magnetisable printing form and are transferred from there on to the carrier substrate. 
   
   
       18 . A process as set forth in  claim 1 , wherein the magnetic particles are applied to the carrier substrate and the printing form with the latent magnetic image is arranged on the side of the carrier substrate which is in opposite relationship to the magnetic particles applied to the carrier substrate. 
   
   
       19 . (canceled) 
   
   
       20 . (canceled) 
   
   
       21 . (canceled) 
   
   
       22 . (canceled) 
   
   
       23 . A multi-layer body having a partially shaped electrically conductive structure, wherein
 the multi-layer body has a layer of magnetic particles having an electrically conductive surface, which are arranged in the graphic form of the electrically conductive structure, and wherein the magnetic particles are connected together by means of a first electrically conductive layer.   
   
   
       24 . A multi-layer body as set forth in  claim 23 , wherein the first electrically conductive layer is of a thickness of between 40 nm and 70 nm. 
   
   
       25 . (canceled) 
   
   
       26 . A multi-layer body as set forth in  claim 23 , wherein the multi-layer body has a second electrically conductive layer which is in the form of an electrical functional layer and which is galvanically applied to the magnetic particles and/or the first electrically conductive layer and which is of a layer thickness of between 2 μm and 50 μm. 
   
   
       27 . A multi-layer body as set forth in  claim 26 , wherein the second electrically conductive layer comprises a metal with a low specific resistance selected from the group consisting of as aluminum, copper, nickel, silver and gold. 
   
   
       28 . A multi-layer body as set forth in the magnetic particles are of a flake configuration. 
   
   
       29 . A multi-layer body as set forth in  claim 23 , wherein the magnetic particles are embedded in an adhesion layer which is of a layer thickness which is between 50% and 80% of the mean diameter of the magnetic particles. 
   
   
       30 . A multi-layer body as set forth in  claim 29 , wherein the magnetic particles project out of the adhesion layer by between 5% and 95% of their mean diameter. 
   
   
       31 . A multi-layer body as set forth in  claim 23 , wherein the magnetic particles are formed from a soft-magnetic core and an electrically conducting casing, selected from the group consisting of iron, copper, nickel, gold, tin, zinc and alloys thereof.