Chemical mechanical polishing pad and method for manufacturing same

Abstract

There is provided a chemical mechanical polishing pad which has a circular polishing surface and a non-polishing surface that is the back side of the polishing surface and incorporates an information recording medium that is readable or readable/writable by an electromagnetic wave in a noncontact manner and in which the position of the center of gravity of the information recording medium in the radial direction of the polishing surface is preferably within a range of 0 to 10% or 80 to 100% of the radius of the polishing surface in the direction from the center on the radius of the polishing surface toward the periphery of the polishing surface.

1 . A chemical mechanical polishing pad having a circular polishing surface and a non-polishing surface which is the back side of the polishing surface and incorporating an information recording medium which is readable or readable/writable by an electromagnetic wave in a noncontact manner. 
     
     
         2 . The chemical mechanical polishing pad of  claim 1 , wherein the position of the center of gravity of the information recording medium in the radial direction of the polishing surface is within a range of 0 to 10%- or 80 to 100% of the radius of the polishing surface in the direction from the center on the radius of the polishing surface toward the periphery of the polishing surface. 
     
     
         3 . The chemical mechanical polishing pad of  claim 1 , wherein the position of the center of gravity of the information recording medium in the thickness direction of the pad is within a range of 50 to 100% of the thickness of the pad in the direction from the polishing surface toward the non-polishing surface. 
     
     
         4 . The chemical mechanical polishing pad of  claim 1 , wherein the non-polishing surface has a hollow, and a part or all of the shape of the information recording medium projected onto the non-polishing surface is within the range of the hollow. 
     
     
         5 . A method for producing the chemical mechanical polishing pad of  claim 1 , comprising the following steps:
 (A1) a step of preparing a composition for the chemical mechanical polishing pad,   (A2) a step of molding a rough pad form from the composition, the rough pad form having a surface that is to be a circular polishing surface and a surface that is to be a non-polishing surface which is the back side of the polishing surface,   the rough pad form having an opening where an information recording medium is to be placed, on the surface that is to be the non-polishing surface of the pad,   (A3) a step of placing the information recording medium in the opening and filling the remaining space in the opening with the composition for the chemical mechanical polishing pad, and   (A4) a step of heating the rough pad form to a temperature of 150 to 180° C. under a pressure of 1 to 20 MPa.   
     
     
         6 . A method for producing the chemical mechanical polishing pad of  claim 1 , comprising the following steps:
 (B1) a step of preparing a composition for the chemical mechanical polishing pad,   (B2) a step of molding a rough pad form from the composition, the rough pad form having a surface that is to be a circular polishing surface and a surface that is to be a non-polishing surface which is the back side of the polishing surface,   the rough pad form having an opening where an information recording medium is to be placed, on the surface that is to be the non-polishing surface of the pad, and   (B3) a step of attaching the information recording medium to the opening.   
     
     
         7 . The method of  claim 5  or  6 , wherein the composition for the chemical mechanical polishing pad comprises (a) at least one selected from the group consisting of a thermoplastic resin, an elastomer, rubber and a curable resin and (b) water-soluble particles. 
     
     
         8 . The method of  claim 5  or  6 , wherein the composition for the chemical mechanical polishing pad comprises (1) a polyol, (2) a polyisocyanate and (3) a foaming agent.