Electronic apparatus

Abstract

An electronic apparatus includes: a circuit board that is mounted with a first heat generating component and a second heat generating component that generate heat; and a circulation-type heat pipe that circulates a coolant, the heat pipe including: a first heat reception part that receives heat from the first heat generating component, the first heat reception part being provided with a wick for evaporating the coolant to serve as an evaporation part; a second heat reception part that receives heat from the second heat generating component and circulates the coolant to the first heat reception part; and a condensation part that condenses the coolant circulated from the first heat reception part, the condensation part being provided between the first heat reception part and the second heat reception part.

1 . An electronic apparatus comprising:
 a circuit board that is mounted with a first heat generating component and a second heat generating component that generate heat; and   a circulation-type heat pipe that circulates a coolants the heat pipe including:
 a first heat reception part that receives heat from the first heat generating component, the first heat reception part being provided with a wick for evaporating the coolant to serve as an evaporation part; 
 a second heat reception part that receives heat from the second heat generating component and circulates the coolant to the first heat reception part; and 
 a condensation part that condenses the coolant circulated from the first heat reception part, the condensation part being provided between the first heat reception part and the second heat reception part. 
   
   
   
       2 . The apparatus according to  claim 1 , wherein the heat pipe further includes a heat sink that is thermally connected to the condensation part. 
   
   
       3 . The apparatus according to  claim 2  further comprising a fan that sends air flow to the heat sink. 
   
   
       4 . The apparatus according to  claim 3 , wherein a flow path of the coolant between the evaporation part and the condensation part is a steam pipe, and
 wherein a flow path of the coolant between the condensation part and the evaporation part is a liquid pipe.   
   
   
       5 . The apparatus according to  claim 4 , wherein the circuit board is further mounted with a third heat generating component that generates heat, and
 wherein the heat pipe further includes a third heat reception part that receives heat from the third heat generating component at a midpoint in the liquid pipe.   
   
   
       6 . The apparatus according to  claim 5 , wherein the first heat generating component has the largest calorific value with respect to the second heat generating component and the third heat generating component. 
   
   
       7 . The apparatus according to  claim 6 , wherein the heat pipe is formed by overlapping and joining two thin plate members. 
   
   
       8 . The apparatus according to  claim 2  further comprising a chiller that chills the condensation part by circulating a liquid in a pipe member.