Thermal device for heat exchange

Abstract

A thermal device for heat exchange between a substance in solid state and a substance in liquid state comprising a housing formed by two heat conducting plates disposed in parallel wherein wire-made grid-like 3-dimensional bracing is disposed between said plates and adapted to provide turbulent flow of said substance in liquid state; wires of said bracing are mechanically connected together and to said plates. A thermal device for heat exchange between a substance in solid state and a substance in gaseous state. A heat pipe container having a working fluid enclosed therein, said container formed by two heat conducting plates disposed in parallel against each other and sealed along their perimeter; said container having a capillary microchannel system for reversible fluid-gas circulation, wherein said capillary microchannel system is formed by wire-made grid-like 3-dimensional bracing disposed between said plates; wires of said bracing are mechanically connected together and to said plates.

1 . A thermal device for heat exchange between a substance in solid state and a substance in liquid state comprising a housing formed by two heat conducting plates disposed in parallel against each other and sealed along their perimeter, at least one said plate is thermally contacted with said substance in solid state; said housing has an input and an output ports for inflowing and outflowing said substance in liquid state; wherein wire-made grid-like 3-dimensional bracing is disposed between said plates and adapted to provide turbulent flow of said substance in liquid state; wires of said bracing are mechanically connected together and to said plates. 
   
   
       2 . A thermal device for heat exchange according  claim 1 , wherein said plates and wires are made of copper. 
   
   
       3 . A thermal device for heat exchange according  claim 1 , wherein said plates and wires are made of aluminum. 
   
   
       4 . A thermal device for heat exchange according  claim 1 , wherein said plates are made of tin plated steel. 
   
   
       5 . A thermal device for heat exchange according  claim 1 , wherein said wires and said plates are mechanically connected by soldering. 
   
   
       6 . A thermal device for heat exchange according  claim 1 , wherein said wires and said plates are mechanically connected by welding. 
   
   
       7 . A thermal device for heat exchange between a substance in solid state and a substance in gaseous state comprising a housing formed by two heat conducting plates disposed in parallel against each other and pressurized along their perimeter, at least one said plate is thermally contacted with said substance in solid state; said housing has an input and an output ports for inflowing and outflowing said substance in gaseous state; wherein wire-made grid-like 3-dimensional bracing is disposed between said plates and adapted to provide turbulent flow of said substance in liquid state; wires of said bracing are mechanically connected together and to said plates. 
   
   
       8 . A thermal device for heat exchange according  claim 7 , wherein said plates and wires are made of copper. 
   
   
       9 . A thermal device for heat exchange according  claim 7 , wherein said plates and wires are made of aluminum. 
   
   
       10 . A thermal device for heat exchange according  claim 7 , wherein said plates are made of tin plated steel. 
   
   
       11 . A thermal device for heat exchange according  claim 7 , wherein said wires and said plates are mechanically connected by soldering. 
   
   
       12 . A thermal device for heat exchange according  claim 7 , wherein said wires and said plates are mechanically connected by welding. 
   
   
       13 . A heat exchanger device for heat exchange between two heat transfer agents comprising two said thermal devices wherein said thermal devices are thermally contacted with each other. 
   
   
       14 . A heat exchanger device for heat exchange according to  claim 13  wherein said heat transfer agents in both said thermal devices are in fluid state. 
   
   
       15 . A heat exchanger device for heat exchange according to  claim 13  wherein said heat transfer agents in both said thermal devices are in gaseous state. 
   
   
       16 . A heat exchanger device for heat exchange according to  claim 13  wherein heat exchange is carried out between said heat transfer agents in fluid and gaseous states. 
   
   
       17 . A heat pipe container having a working fluid enclosed therein, said container formed by two heat conducting plates disposed in parallel against each other and sealed along their perimeter; said container having a capillary microchannel system for reversible fluid-gas circulation, wherein said capillary microchannel system is formed by wire-made grid-like 3-dimensional bracing disposed between said plates; wires of said bracing are mechanically connected together and to said plates. 
   
   
       18 . A heat pipe container according  claim 17 , wherein said plates and wires are made of copper. 
   
   
       19 . A heat pipe container according  claim 17 , wherein said plates and wires are made of aluminum. 
   
   
       20 . A heat pipe container according  claim 17 , wherein said plates are made of tin plated steel. 
   
   
       21 . A heat pipe container according  claim 17 , wherein said wires and said plates are mechanically connected by soldering. 
   
   
       22 . A heat pipe container according  claim 17 , wherein said wires and said plates are mechanically connected by welding.