US2009059774A1PendingUtilityA1
Method of storing a data bit in a phase change alloy material with an electron beam
Est. expiryDec 28, 2022(expired)· nominal 20-yr term from priority
G11C 7/005H01J 37/3053G11B 9/10G11B 9/04G11B 2005/0021
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Abstract
Alloy memory structures and methods are disclosed wherein a layer or volume of alloy material changes conductivity subsequent to introduction of a electron beam current-induced change in phase of the alloy, the conductivity change being detected using current detection means such as photon-emitting P-N junctions, and being associated with a change in data bit memory state.
Claims
exact text as granted — not AI-modified1 . A method of storing a data bit comprising:
exposing a volume of fast-write alloy to an electron beam to heat the volume of fast-write alloy to a temperature equivalent to about 110% of the melting temperature for the fast-write alloy; cooling the volume of fast-write alloy along a cooling profile associated with an amorphous phase and a stored data bit memory state.
2 . The method of claim 1 wherein cooling the volume of fast-write alloy along a cooling profile comprises cooling past the recrystallization temperature for the volume of fast-write alloy within 2 nanoseconds.
3 . The method of claim 1 wherein cooling the volume of fast-write alloy comprises a cooling rate that is faster than a crystal nucleation and growth rate to avoid a formation of a highly-ordered crystalline structure.
4 . The method of claim 1 wherein the fast-write alloy is used in high-speed optical storage devices.
5 . The method of claim 1 wherein the fast-write alloy comprises combinations of Germanium, Antimony, and Tellurium.
6 . The method of claim 1 wherein the fast-write alloys comprises combinations of Silver, Indium, Antimony, and Tellurium.
7 . The method of claim 1 wherein the amorphous phase has relatively low electrical conductivity.
8 . The method of claim 1 wherein a relatively fast cooling is achieved by avoiding further e-beam irradiation.
9 . The method of claim 8 wherein the relatively fast cooling prevents the heated material from nucleating relatively large, contiguous crystals based upon adjacent crystallites of a same material positioned around a boundary of a heated region.
10 . The method of claim 5 wherein the melting temperature is 616 degrees Celsius.
11 . The method of claim 5 wherein the recrystallization temperature is 142 degrees Celsius.
12 . The method of claim 1 wherein the fast-write alloy is melted since an amorphous phase result is desired.
13 . The method of claim 1 wherein a faster cooling profile is achieved by avoiding thermal mass in an adjacent structure during the cooling.
14 . The method of claim 1 wherein the cooling at a data cell location may be controllably speeded up by not irradiating structures immediately surrounding the location to create thermal mass around the location.
15 . The method of claim 1 wherein the electron beam is modulated to a higher energy to write the data bit.
16 . The method of claim 1 wherein writing the data bit is accomplished at a higher energy than reading the data bit.Cited by (0)
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