Method of fabricating organic electronic device

Abstract

A fabricating method of organic electronic device is provided. The method comprises: providing a flexible substrate; fabricating a plurality of organic elements on the flexible substrate; depositing a patterned spacing layer on the flexible substrate with a spacing material deposition source and a mask; and arranging a cover substrate on the patterned spacing layer, and sealing the edges of the flexible substrate and the cover substrate with a sealant, wherein the patterned spacing layer is used to maintain a space between the flexible substrate and the cover substrate.

1 . A method of fabricating an organic electronic device, comprising:
 providing a flexible substrate;   fabricating a plurality of organic elements on the flexible substrate;   depositing a patterned spacing layer on the flexible substrate with a spacing material deposition source and a mask; and   arranging a cover substrate on the patterned spacing layer, and sealing the edges of the flexible substrate and the cover substrate with a sealant, wherein the patterned spacing layer is used to maintain a space between the flexible substrate and the cover substrate.   
   
   
       2 . The method of fabricating an organic electronic device as claimed in  claim 1 , wherein the spacing material deposition source deposits the patterned spacing layer with a process comprising at least one of plasma enhanced chemical vapor deposition (PECVD), vacuum thermal evaporation (VTE), E-beam evaporation, sputtering or any combination thereof. 
   
   
       3 . The method of fabricating an organic electronic device as claimed in  claim 1 , wherein the material of the patterned spacing layer includes polymers. 
   
   
       4 . The method of fabricating an organic electronic device as claimed in  claim 1 , wherein the material of the patterned spacing layer includes organic oligomer. 
   
   
       5 . The method of fabricating an organic electronic device as claimed in  claim 1 , wherein the material of the patterned spacing layer includes polymers mixed with microcolumns. 
   
   
       6 . The method of fabricating an organic electronic device as claimed in  claim 1 , wherein the material of the patterned spacing layer includes organic oligomer and polymers mixed with microcolumns. 
   
   
       7 . The method of fabricating an organic electronic device as claimed in  claim 1 , wherein the material of the patterned spacing layer includes parylene. 
   
   
       8 . The method of fabricating an organic electronic device as claimed in  claim 1 , wherein the material of the patterned spacing layer includes oxides. 
   
   
       9 . The method of fabricating an organic electronic device as claimed in  claim 1 , wherein the material of the patterned spacing layer includes metal oxide derivatives.