Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging

Abstract

A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

1 . A test environment, comprising a chamber containing S samples, a pressurized gas, and moisture, wherein the S samples each comprise a semiconductor packaging material that comprises one or more cured raw materials that include a molding compound, wherein S is at least 1 and if S>1 then the S samples are substantially identical, wherein the S samples are being exposed to the pressurized gas and the moisture, wherein the pressurized gas includes at least one of oxygen gas and an inert gas, wherein the pressurized gas has a temperature T satisfying T G −ΔT 2 ≦T≦T G −ΔT 1  such that 0<ΔT 1 ≦ΔT 2  for glass transition temperature T G  of the molding compound, wherein the moisture has a relative humidity H such that H 1 ≦H≦H 2 , wherein H 1 ≧20% and H 2 ≦100%, wherein T G −ΔT 2  is at least about 20° C., wherein if the pressurized gas includes the oxygen gas then the partial pressure of the oxygen gas is at least about 15 psi, and wherein if the pressurized gas does not include the oxygen gas then the pressure of the inert gas is at least about 15 psi. 
     
     
         2 . The test environment of  claim 1 , wherein the chamber comprises instrumentation configured to measure the pressure of the pressurized gas, the temperature T, and the relative humidity H.