Adjustable cooling unit for semiconductor module

Abstract

A cooling unit for a semiconductor module includes a plate shaped first cooling body, a plate shaped second cooling body opposing the first cooling body and an adjustable cooling member placed between the first and second cooling bodies so that a distance between the first and second cooling bodies may be adjusted. Shapes of the cooling body include a honeycomb structure, cylinders, a hemicylindrical shape, a zigzag shape, and a bellows structure shape. By forming the cooling unit with an adjustable cooling member, the cooling unit can fit electronic devices of various sizes.

1 . A cooling unit for a semiconductor module, comprising:
 a plate shaped first cooling body;   a plate shaped second cooling body opposing the first cooling body; and   a cooling member placed between the first and second cooling bodies, the cooling member being adjustable in volume such that a distance between the first and second cooling bodies are adjusted.   
   
   
       2 . The cooling unit for a semiconductor module according to  claim 1 , wherein at least one of the first and second cooling members includes a metal. 
   
   
       3 . The cooling unit for a semiconductor module according to  claim 1 , wherein the cooling member has a honeycomb structure having a plurality of parallel parts and angled parts which form hexagonal sections. 
   
   
       4 . The cooling unit for a semiconductor module according to  claim 3 , wherein the cooling member comprises:
 a first cooling member having a plurality of first adhesive parts having a first width and a plurality of first volume adjusting part having a second width, wherein the first adhesive parts and the first volume adjusting parts are connected and alternate such that a first half of each hexagonal section is formed;   a second cooling member having a plurality of second adhesive parts corresponding to the first adhesive parts and a plurality of second volume adjusting parts corresponding to the first volume adjusting parts, such that a second half of the hexagonal sections that are opposite to the first half are formed; and   an adhesive member placed between the first and the second adhesive parts which contact each other.   
   
   
       5 . The cooling unit for a semiconductor module according to  claim 4 , wherein a plurality of cooling members are placed in a manner such that the cooling members interconnect. 
   
   
       6 . The cooling unit for a semiconductor module according to  claim 4 , wherein the first width is narrower than the second width. 
   
   
       7 . The cooling unit for a semiconductor module according to  claim 1 , wherein the cooling member has a plurality of cylinders. 
   
   
       8 . The cooling unit for a semiconductor module according to  claim 7 , wherein the plurality of cylinders are arranged in a row between the first cooling body and the second cooling body. 
   
   
       9 . The cooling unit for a semiconductor module according to  claim 1 , wherein the cooling member has a hemicylindrical shape in which a curved face thereof is in contact with an inner face of the first cooling body and both ends thereof are in contact with an inner face of the second cooling body. 
   
   
       10 . The cooling unit for a semiconductor module according to  claim 9 , wherein the cooling member has rumples for increasing a contact area between the cooling member and the first cooling body. 
   
   
       11 . The cooling unit for a semiconductor module according to  claim 1 , wherein the cooling member contains a plurality of faces forming a zigzag shape, wherein a first face contacts the first cooling body, and a last face contacts the second cooling body. 
   
   
       12 . The cooling unit for a semiconductor module according to  claim 11 , wherein the cooling member has rumples to increase a contact area between the first face and the first cooling body and the last face and the second cooling body. 
   
   
       13 . The cooling unit for a semiconductor module according to  claim 1 , wherein the cooling member has a bellows structure shape. 
   
   
       14 . The cooling unit for a semiconductor module according to  claim 1 , further comprising:
 a coupling protrusion that protrudes from a side face of the first cooling body and extends toward the second cooling body, and   a coupling recess formed in the second cooling body in which the coupling protrusion is inserted.   
   
   
       15 . The cooling unit for a semiconductor module according to  claim 1 , further comprising:
 a protrusion part for connecting the cooling unit to a semiconductor module, wherein the protrusion part protrudes from a side face of the first cooling body and the protrusion part has a through hole.