Apparatus for detecting pattern alignment error

Abstract

An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied to the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first conductive pattern for detecting an alignment error in response to a position of the conductive via. The apparatus for detecting pattern alignment error can detect the alignment of lower wiring in a device with multi-layer wiring

1 . An apparatus for detecting a pattern alignment error, comprising:
 a first conductive pattern disposed over a first insulation member, wherein a power source is applied to the first conductive pattern;   a second insulation member covering the first conductive pattern;   a second conductive pattern disposed on the second insulation layer;   a conductive via electrically connected to the second conductive pattern and passing through the second insulation member; and   an insulation pattern disposed in the first conductive pattern for detecting an alignment error in response to a position of the conductive via.   
   
   
       2 . The apparatus for detecting a pattern alignment error according to  claim 1 , wherein the insulation pattern is a through hole passing through the first conductive pattern. 
   
   
       3 . The apparatus for detecting a pattern alignment error according to  claim 1 , wherein the insulation pattern is disposed over the first conductive pattern. 
   
   
       4 . The apparatus for detecting a pattern alignment error according to  claim 1 , wherein the power source is a DC voltage. 
   
   
       5 . The apparatus for detecting a pattern alignment error according to  claim 1 , wherein an area of the insulation pattern is 105% to 200% of an area of the conductive via. 
   
   
       6 . The apparatus for detecting a pattern alignment error according to  claim 5 , wherein the insulation pattern has a circular shape when viewed from above and a diameter of the insulation pattern is 50 μm to 200 μm. 
   
   
       7 . The apparatus for detecting a pattern alignment error according to  claim 1 , further comprising:
 a third conductive pattern disposed over the second insulation member;   an additional conductive via passing through the second insulation member, wherein the additional conductive via is electrically connected to the third conductive pattern and the first conductive pattern;   wherein the power source is electrically connected to the third conductive pattern rather than the first conductive pattern.   
   
   
       8 . The apparatus for detecting a pattern alignment error according to  claim 7 , wherein a plated layer is formed over the second and third conductive patterns when when the position of the conductive via is such that the conductive via is on the first conductive pattern. 
   
   
       9 . The apparatus for detecting a pattern alignment error according to  claim 7 , wherein a plating layer is formed over only the third conductive pattern when the position of the conductive via is such that the conductive via is over the insulation pattern. 
   
   
       10 . The apparatus for detecting a pattern alignment error according to  claim 1 , wherein a number of the second conductive pattern is at least two, and each insulation pattern corresponds to each second conductive pattern, and the insulation patterns have different sizes.