US2009071169A1PendingUtilityA1
Micro-heatpipe based cold and hot pad
Est. expirySep 19, 2027(~1.1 yrs left)· nominal 20-yr term from priority
Inventors:Fu-Jen Kao
F25D 2400/26F28D 15/0266F28D 2015/0225F28D 15/0233F25B 2321/021F25B 21/04F25B 2321/023
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Claims
Abstract
The present invention provides a micro-heatpipe based cold and holt microtube, including a cold chip, hot chip and a power-controller.
Claims
exact text as granted — not AI-modified1 - 7 . (canceled)
8 . A micro-heatpipe based cold/hot pad, comprising:
a TEC in which after being connected to a direct current produces a heat-absorbing cold end and a heat-releasing hot end, and when the voltage is reversed, the cold end becomes the hot end and vice versa; a micro-heatpipe which is attached to the hot end of the TEC for the purpose of heat exchange; and a power control component which is electrically connected to the TEC to supply power to the TEC and to regulate the charge polarity of the power input.
9 . The pad of claim 8 further comprising a cold/hot pad, cold/hot conduction case or any packaging with heat conducting capabilities.
10 . The pad of claim 8 wherein the power control component further comprises a power supply and a power switch.
11 . The pad of claim 10 wherein the said power supply provides electricity to the TEC, the said power switch regulates the charge polarity of the power input, for the TEC to achieve cooling or heating effect based on the polarity of the power input.
12 . The pad of claim 8 wherein the cold/hot pad further comprises a temperature control device to adjust the degree of cooling or heating of the TEC.
13 . The pad of claim 12 wherein the temperature control device is a variable resistor.
14 . The pad of claim 12 wherein the temperature control device further comprises a DC power switch and a sensor.
15 . The pad of claim 8 further comprising a fixing device to secure the cold/hot pad at a fixed body part.
16 . The pad of claim 8 wherein the said power control component and the cooling device are further installed on different base boards connected via a wire to lessen the weight burden on users since the cooling device is worn separated from the power control component.Join the waitlist — get patent alerts
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