Polishing pad conditioner and method for conditioning polishing pad

Abstract

A polishing pad conditioner is provided. The polishing pad includes a substrate, at least one surface-conditioning unit, and at least one groove-cleaning unit. The surface-conditioning unit and the groove-cleaning unit are both disposed on a surface of the substrate. In addition, the surface-conditioning unit is integrally formed with the groove-cleaning unit form.

1 . A polishing pad conditioner, comprising:
 a substrate;   at least one surface-conditioning unit disposed on a surface of the substrate; and   at least one groove-cleaning unit disposed on the surface of the substrate, wherein the surface-conditioning unit is integrally formed with the groove-cleaning unit.   
   
   
       2 . The polishing pad conditioner in accordance with  claim 1 , wherein the groove-cleaning unit comprises a brush-like member. 
   
   
       3 . The polishing pad conditioner in accordance with  claim 2 , wherein the material of the brush-like member comprises nylon. 
   
   
       4 . The polishing pad conditioner in accordance with  claim 1 , wherein the groove-cleaning unit comprises a configuration on the surface of the substrate. 
   
   
       5 . The polishing pad conditioner in accordance with  claim 1 , wherein the groove-cleaning units surrounds an outer periphery of the surface-conditioning unit. 
   
   
       6 . The polishing pad conditioner in accordance with  claim 1 , wherein the groove-cleaning units are alternately arranged with the surface-conditioning units. 
   
   
       7 . The polishing pad conditioner in accordance with  claim 1 , wherein the surface conditioning unit comprises a plurality of diamond grits. 
   
   
       8 . A method for conditioning a polishing pad, comprising:
 providing a polishing pad conditioner comprising at least one surface-conditioning unit and at least one groove-cleaning unit, wherein the surface-conditioning unit is integrally formed with the groove-cleaning unit;   bringing the surface-conditioning unit and the groove-cleaning unit into contact with each other; and   moving the polishing pad conditioner and the polishing pad relative to each other so as to condition the polishing pad with the surface-conditioning unit, and removing residual particles on the polishing pad with the groove-cleaning unit, simultaneously.   
   
   
       9 . The method for conditioning a polishing pad in accordance with  claim 8 , wherein the groove-cleaning unit comprises a brush-like member. 
   
   
       10 . The method for conditioning a polishing pad in accordance with  claim 9 , wherein the material of the brush-like member comprises nylon. 
   
   
       11 . The method for conditioning a polishing pad in accordance with  claim 8 , wherein the surface-conditioning unit comprises a plurality of diamond grits. 
   
   
       12 . The method for conditioning a polishing pad in accordance with  claim 8 , wherein the step of moving the polishing pad conditioner and the polishing pad relative to each other comprises rotating the polishing pad conditioner and the polishing pad, respectively.