Earthboring tool and method of casehardening

Abstract

A method of casehardening an earthboring tool component includes steps of providing an earthboring tool component and providing a semiconductor light emitting device carried by a mechanical arm. The mechanical arm is used to move the semiconductor light emitting device relative to the earthboring tool component. Light emitted by the semiconductor light emitting device is directed to a surface of the earthboring tool component so that it is casehardened.

1 . A method of casehardening an earthboring tool, comprising:
 providing a first earthboring tool component;   providing a semiconductor light emitting device carried by a mechanical arm; and   directing light emitted by the semiconductor light emitting device to a first surface of the first earthboring tool component.   
   
   
       2 . The method of  claim 1 , further including rotating the first earthboring tool component. 
   
   
       3 . The method of  claim 1 , further including adjusting, with the mechanical arm, the distance between the semiconductor light emitting device and first surface to adjust the amount of optical power applied to the first surface. 
   
   
       4 . The method of  claim 1 , further including adjusting, with the mechanical arm, the angle of incidence of the light incident to the first surface to adjust the amount of optical power applied to the first surface. 
   
   
       5 . The method of  claim 1 , further including moving, along a predetermined path, the position of the semiconductor light emitting device relative to the first earthboring tool component. 
   
   
       6 . The method of  claim 1 , further including moving the position of the semiconductor light emitting device to direct the light to a second surface of the first earthboring tool component. 
   
   
       7 . The method of  claim 1 , further including directing light emitted by the semiconductor light emitting device to a second earthboring tool component. 
   
   
       8 . A method of assembling an earthboring tool, comprising:
 providing an earthboring tool which includes first and second earthboring tool components;   rotating the first earthboring tool component;   directing light from a semiconductor light emitting device to a surface of the first earthboring tool component.   
   
   
       9 . The method of  claim 8 , wherein the semiconductor light emitting device is carried by a mechanical arm. 
   
   
       10 . The method of  claim 9 , further including adjusting the distance between the semiconductor light emitting device and the surface by adjusting the position of the mechanical arm. 
   
   
       11 . The method of  claim 9 , further including adjusting the angle of incidence of the light relative to the surface by adjusting the position of the mechanical arm. 
   
   
       12 . The method of  claim 8 , further including replacing the first earthboring tool component with the second earthboring tool component. 
   
   
       13 . The method of  claim 12 , further including rotating the second earthboring tool component and directing light from the semiconductor light emitting device to its surface. 
   
   
       14 . The method of  claim 13 , further including coupling the first and second earthboring tool components together. 
   
   
       15 . A method of assembling an earthboring tool, comprising:
 providing an earthboring tool component;   coupling the earthboring tool component to a rotary system;   providing a mechanical arm which carries a semiconductor light emitting device;   directing light emitted by the semiconductor light emitting device to a surface of the earthboring tool component.   
   
   
       16 . The method of  claim 15 , further including moving the semiconductor light emitting device relative to the surface of the earthboring tool component with the mechanical arm. 
   
   
       17 . The method of  claim 15 , further including rotating the earthboring tool component with the rotary system. 
   
   
       18 . The method of  claim 15 , wherein the earthboring tool component includes a channel and the surface is bounded by the channel. 
   
   
       19 . The method of  claim 18 , wherein the semiconductor light emitting device extends into the channel. 
   
   
       20 . The method of  claim 15 , further including moving the semiconductor light emitting device, with the mechanical arm, so the light is directed to another surface of the earthboring tool component.