Systems And Methods For Electroplating Embossed Features On Substrates

Abstract

Systems and methods for electroplating embossed features on substrates are disclosed. In an exemplary implementation, a method may include positioning a device in close proximity to an anode. The device may have embossed trenches. The method may also include delivering pressurized electrolyte to the anode. The method may also include activating electrical power between the anode and the device. The metal ions migrate into the embossed trenches to form electroplated metal traces on the device

1 . A method for electroplating embossed features on a substrate, comprising:
 positioning a device in close proximity to an anode, the device having embossed trenches;   delivering pressurized electrolyte to the anode; and   activating electrical power between the anode and the device, wherein metal ions migrate into the embossed trenches to form electroplated metal traces on the device.   
   
   
       2 . The method of  claim 1 , further comprising fully wetting the anode before activating electrical power. 
   
   
       3 . The method of  claim 1 , further comprising applying pressure to the device to reduce space between the device and the anode. 
   
   
       4 . The method of  claim 1 , further comprising returning electrolyte to a reservoir. 
   
   
       5 . The method of  claim 1 , further comprising preventing short-circuiting even if the electroplated metal traces inadvertently contact the anode. 
   
   
       6 . The method of  claim 1 , further comprising forcing air between the anode and the electrolyte through pores formed in the anode. 
   
   
       7 . The method of  claim 1 , further comprising supplying the metal ions from the electrolyte. 
   
   
       8 . The method of  claim 1 , further comprising supplying the metal ions from the anode. 
   
   
       9 . A system for electroplating embossed features on a substrate, comprising:
 an anode configured to be positioned in close proximity to a device;   a pump operating to deliver a pressurized electrolyte to the anode; and   electrical power for connecting between the anode and the device, the electrical power causing metal ions to migrate onto exposed metal surfaces on the device to form electroplated metal traces.   
   
   
       10 . The system of  claim 9 , further comprising a planar production configuration. 
   
   
       11 . The system of  claim 9 , further comprising a roll-to-roll production configuration. 
   
   
       12 . The system of  claim 9 , wherein the device serves as a cathode for an electroplating circuit. 
   
   
       13 . The system of  claim 9 , wherein the anode is fully wetted before activating electrical power. 
   
   
       14 . The system of  claim 9 , wherein the anode is hydrophilic. 
   
   
       15 . The system of  claim 9 , wherein an outer layer of the anode is non-conductive ceramic to prevent short-circuiting even if the electroplated metal traces inadvertently contact the anode. 
   
   
       16 . The system of  claim 9 , wherein the anode is non-sacrificial and metal ions are provided at least in part from the electrolyte. 
   
   
       17 . The system of  claim 9 , wherein the anode is sacrificial and metal ions are provided at least in part from the anode. 
   
   
       18 . The system of  claim 9 , further comprising embossed trenches on the device, the embossed trenches corresponding to desired traces on the device to the electrolyte. 
   
   
       19 . A system for electroplating embossed features on a substrate, comprising:
 fluid delivery means for providing a metered flow of pressurized electrolyte to a device having embossed trenches;   positive charge means for delivering metal ions into the embossed trenches of the device; and   negative charge means for attracting the metal ions into the embossed trenches, wherein the metal ions migrate uniformly into the embossed trenches to form electroplated metal traces on the device.   
   
   
       20 . The method of  claim 1 , further comprising secondary means for providing metal ions. 
   
   
       21 . A system for electroplating embossed features on a substrate, comprising:
 a drum anode rotatably positioned directly adjacent to a device having resin-embossed features, the device in constant contact with substantially a same position on the drum anode while the drum rotates;   a pump operating to deliver a continuous pressurized electrolyte inside the drum anode;   pores formed in the drum anode to expel electrolyte onto the device as the device rotates over an external surface of the drum, and   electrical power for connecting between the drum anode and the device, the electrical power causing metal ions to migrate through the pores onto exposed metal surfaces formed by the resin-embossed features on the device to form electroplated metal traces.