Cooling Body for Electronics Housing

Abstract

A method for producing a cooling body including cooling ribs for an electronic housing, in particular for the automotive industry, includes producing extruded profile slabs having cooling ribs which extend in a parallel manner. The profile slabs are disposed next to each other in relation to a surface which includes cooling ribs that are disposed in parallel. The profile slabs are cut to length by a profile circular saw having step profiles. In this way, the production process for producing a cooling body from extruded aluminum is variable for the first time in relation to the shape of the cooling body in such a way that the individual requirements in the electronic housing in relation to heat which is to be withdrawn, sealing between the housing and cooling body, and size of the cooling body, are taken into account. It is particularly suitable for use in the automotive industry.

1 - 8 . (canceled) 
   
   
       9 . A method for producing a cooling body with cooling fins for an electronics housing, the method comprising the following steps:
 producing extruded profile slabs with cooling fins running parallel to each other;   aligning the profile slabs alongside each other relative to a surface with the cooling fins disposed in parallel; and   cutting the profile slabs to length with a profile circular saw having a step profile.   
   
   
       10 . The method according to  claim 9 , which further comprises providing the profile slabs with flange-type profiling disposed parallel to the cooling fins. 
   
   
       11 . The method according to  claim 9 , which further comprises extruding the profile slabs with a different number of cooling fins. 
   
   
       12 . The method according to  claim 9 , which further comprises producing the cooling body with a different length, width and profile depth geometry. 
   
   
       13 . The method according to  claim 9 , which further comprises bending the profile slabs to form cooling bodies of different sizes. 
   
   
       14 . The method according to  claim 9 , which further comprises extruding the profile slabs from aluminum. 
   
   
       15 . The method according to  claim 9 , which further comprises carrying out the step of cutting to length with the profile circular saw by using a profile circular saw permitting a variable configuration of circular saw blades. 
   
   
       16 . The method according to  claim 9 , which further comprises performing the step of cutting the slabs to length and cutting a profile in one step. 
   
   
       17 . The method according to  claim 9 , wherein the electronics housing is an automotive industry housing.