Substrate processing apparatus and substrate processing method

Abstract

The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder 11 for holding a substrate W substantially horizontally and rotating the substrate W, and a processing liquid supply unit 15 for supplying a processing liquid onto a peripheral portion of the substrate W which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate W. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder 54 for holding a substrate W substantially horizontally and rotating the substrate W, and a cleaning liquid supply unit 53 having a cleaning liquid outlet 53 a which is oriented from a center of the substrate W toward a peripheral portion of the substrate W with an elevation angle of not more than 45° from a surface of the substrate W. The cleaning liquid supply unit 53 supplies a cleaning liquid to the surface of the substrate W at a flow velocity of not less than 0.1 m/s.

1 - 9 . (canceled) 
   
   
       10 . A substrate processing apparatus comprising:
 a substrate holder for holding a substrate substantially horizontally and rotating the substrate; and   a cleaning liquid supply unit having a cleaning liquid outlet which is oriented from a center of the substrate toward a peripheral portion of the substrate with an elevation angle of not more than 45° from a surface of the substrate;   wherein said cleaning liquid supply unit supplies a cleaning liquid to the surface of the substrate at a flow velocity of not less than 0:1 m/s.   
   
   
       11 . A substrate processing apparatus according to  claim 10 , comprising a receiving unit disposed in the same plane as the surface of the substrate and opens toward an area of the substrate where the cleaning liquid is supplied to, the cleaning liquid being received by said receiving unit and recovered through said receiving unit. 
   
   
       12 . A substrate processing apparatus according to  claim 10 , wherein said cleaning liquid supply unit is disposed closely to the surface of the substrate. 
   
   
       13 . A substrate processing apparatus according to  claim 12 , comprising a receiving unit disposed in the same plane as the surface of the substrate and opens toward an area of the substrate where the cleaning liquid is supplied to, the cleaning liquid being received by said receiving unit and recovered through said receiving unit. 
   
   
       14 - 17 . (canceled)