Transponder inlay for a personal document and method of manufacturing same

Abstract

The invention relates to a transponder inlay ( 11 ) for manufacturing a layered structure ( 40 ) for a personal document with a substrate layer ( 12 ) for arranging a transponder unit ( 15 ) that includes an antenna coil ( 13 ) and a chip module ( 14 ) and which is situated on a contact surface ( 17 ) of the substrate layer, wherein the chip module ( 14 ) is accommodated in a window opening ( 30 ) formed in the substrate layer ( 12 ) in such a way that a chip carrier ( 23 ) of the chip module rests with its circumferential edge on a compressed peripheral shoulder ( 24 ) of the window opening ( 30 ); the invention also relates to a method for manufacturing the transponder inlay. In addition, the present invention relates to a layered structure for a personal document, which is provided with such a transponder inlay, and an identification document having such a layered structure.

1 . A transponder inlay for manufacturing a layered structure for a personal document, having a substrate layer for arranging a transponder unit which comprises an antenna coil and a chip module and is situated on a contact surface of the substrate layer, characterized in that:
 the chip module is accommodated in a window opening formed in the substrate layer, such that a chip carrier of the chip module rests with its peripheral edge on a compressed peripheral shoulder of the window opening.   
   
   
       2 . The transponder inlay according to  claim 1 , characterized in that the chip module is accommodated in the window opening in such a way that the chip carrier is essentially flush with the contact surface of the substrate layer and a chip housing of a chip unit arranged on the chip carrier is essentially flush with a bottom side of the substrate layer opposite the contact surface. 
   
   
       3 . The transponder inlay according to  claim 1 , characterized in that the antenna coil is formed from a wire conductor arranged in a coil pattern on the contact surface, said wire conductor being arranged so that it is essentially flush with the contact surface by embedding it in the contact surface. 
   
   
       4 . The transponder inlay according to  claim 1 , characterized in that the substrate layer is made of a thermoelastic material. 
   
   
       5 . Layered structure for a personal document having a transponder inlay according to  claim 1 , wherein a cover layer of a book binding material for personal documents is arranged on the contact surface of the transponder inlay. 
   
   
       6 . The layered structure according to  claim 5 , characterized in that the transponder inlay and the cover layer are joined together by an adhesive intermediate layer. 
   
   
       7 . The layered structure according to  claim 5 , characterized in that the layered structure is designed to be double-sided, having a substrate layer, which is designed to be discontinuous and has the transponder unit on a transponder page and has a blank page separated from the transponder page by a fold recess, as well as having a cover layer that is designed to be continuous and extends over the substrate layer. 
   
   
       8 . The personal document characterized by a layered structure according to  claim 5 . 
   
   
       9 . A method for manufacturing a transponder inlay for a layered structure of a personal document, wherein a substrate layer is provided on a contact surface with an antenna coil and a chip module, characterized in that:
 to form a window opening that accommodates the chip module and has a compressed peripheral shoulder, a through-opening is produced in the substrate layer, and the circumferential edge of the through-opening is subjected to pressure and temperature to achieve a reduced thickness of the substrate layer in the area of the circumferential edge.   
   
   
       10 . The method according to  claim 9 , characterized in that the treatment with pressure and temperature is performed by means of an ultrasonically energized stamping tool. 
   
   
       11 . The method according to  claim 10 , characterized int hat the stamping tool also serves at the same time to form the through-opening. 
   
   
       12 . The method according to  claim 10 , characterized in that the stamping tool serves at the same time to embed a wire conductor that is used to produce the antenna coil in the contact surface of the substrate layer.