Mold for compression molding in the preparation of a unitized membrane electrode assembly

Abstract

The invention provides a mold for use in a compression molding apparatus that has a frame part with a hole through its center; a bottom plunger; and a top plunger; wherein the plungers are fabricated to fit substantially snugly in the hole in the frame part, and wherein at least one plunger comprises at least one low-thermal conductivity insert. The mold is useful in compression molding processes used in the preparation of unitized membrane electrodes.

1 . A mold for use in a compression molding apparatus comprising:
 (a) a frame part with a hole through its center;   (b) a bottom plunger; and   (c) a top plunger; wherein the plungers are fabricated to fit substantially snugly in the hole in the frame part, and wherein at least one plunger comprises at least one low-thermal conductivity insert.   
   
   
       2 . The mold of  claim 1  wherein the at least one low-thermal conductivity insert is present in the top plunger and the bottom plunger. 
   
   
       3 . The mold of  claim 1  wherein the plunger comprises a plurality of low-thermal conductivity inserts. 
   
   
       4 . The mold of  claim 3  wherein the at least low-thermal conductivity insert is a ceramic. 
   
   
       5 . The mold of  claim 4  wherein the ceramic is selected from the group consisting of alumina, alumina silicate, glass, zirconia, and boron nitride. 
   
   
       6 . The mold of  claim 1  wherein the at least one low-thermal conductivity insert is bonded to the at least one plunger with an adhesive. 
   
   
       7 . The mold of  claim 1  wherein the adhesive is a fast cure adhesive. 
   
   
       8 - 21 . (canceled)