Pad conditioner for chemical mechanical polishing

Abstract

A pad conditioner for chemical mechanical polishing includes a dressing component for conditioning a pad and a housing for accommodating the dressing component. The housing includes at least one fluid hole surrounding the dressing component for providing at least a fluid.

1 . A polishing pad conditioner for chemical mechanical polishing, comprising:
 a dressing component for conditioning a pad; and   a housing comprising at least one fluid hole surrounding said dressing component for providing at least one fluid for accommodating said dressing component.   
   
   
       2 . The polishing pad conditioner for chemical mechanical polishing of  claim 1 , wherein said dressing component is round. 
   
   
       3 . The polishing pad conditioner for chemical mechanical polishing of  claim 2 , wherein said housing comprises a plurality of parts. 
   
   
       4 . The polishing pad conditioner for chemical mechanical polishing of  claim 1 , wherein said dressing component is selected from a shape of a polygon consisting of triangle and rectangular. 
   
   
       5 . The polishing pad conditioner for chemical mechanical polishing of  claim 1 , wherein said housing comprises a slot for engaging with said dressing component to fix a relation position between said dressing component and said housing. 
   
   
       6 . The polishing pad conditioner for chemical mechanical polishing of  claim 1 , wherein said fluid is selected from a group consisting of water and slurry. 
   
   
       7 . The polishing pad conditioner for chemical mechanical polishing of  claim 1 , wherein said fluid substantially contacts said dressing component when spurting from said fluid hole. 
   
   
       8 . The polishing pad conditioner for chemical mechanical polishing of  claim 1 , further comprising at least one screw to fix a relation position between said dressing component and said housing. 
   
   
       9 . A polishing pad conditioner for chemical mechanical polishing, comprising:
 a dressing component for conditioning a pad; and   a housing for accommodating said dressing component, said housing comprising at least one fluid hole surrounding said dressing component for providing at least one fluid and a slot for engaging with said dressing component to fix a relation position between said dressing component and said housing.   
   
   
       10 . The polishing pad conditioner for chemical mechanical polishing of  claim 9 , wherein said dressing component is round. 
   
   
       11 . The polishing pad conditioner for chemical mechanical polishing of  claim 10 , wherein said housing comprises a plurality of parts. 
   
   
       12 . The polishing pad conditioner for chemical mechanical polishing of  claim 9 , wherein said dressing component is selected from a shape of a polygon consisting of triangle and rectangular. 
   
   
       13 . The polishing pad conditioner for chemical mechanical polishing of  claim 9 , wherein said fluid is selected from a group consisting of water and slurry. 
   
   
       14 . The polishing pad conditioner for chemical mechanical polishing of  claim 9 , wherein said fluid substantially contacts said dressing component when spurting from said fluid hole. 
   
   
       15 . The polishing pad conditioner for chemical mechanical polishing of  claim 9 , further comprising at least one screw to fix a relation position between said dressing component and said housing. 
   
   
       16 . A method for polishing a substrate, comprising:
 providing a substrate; and   polishing said substrate with a polishing tool, wherein said polishing tool is provided with at least a polishing pad and at least a polishing pad conditioner, and said polishing pad conditioner includes a dressing component for conditioning a pad and a housing for accommodating said dressing component, and said housing includes at least one fluid hole surrounding said dressing component for providing at least a fluid.   
   
   
       17 . The method of  claim 16 , wherein said dressing component is round. 
   
   
       18 . The method of  claim 17 , wherein said housing comprises a plurality of parts. 
   
   
       19 . The method of  claim 16 , wherein said dressing component is selected from a shape of a polygon consisting of triangle and rectangular. 
   
   
       20 . The method of  claim 16 , wherein said housing comprises a slot for engaging with said dressing component to fix a relation position between said dressing component and said housing. 
   
   
       21 . The method of  claim 16 , wherein said fluid is selected from a group consisting of water and slurry. 
   
   
       22 . The method of  claim 16 , wherein said fluid substantially contacts said dressing component when spurting from said fluid hole. 
   
   
       23 . The polishing pad conditioner for chemical mechanical polishing of  claim 16 , further comprising at least one screw to fix a relation position between said dressing component and said housing.