US2009114349A1PendingUtilityA1

Chip mounter

Assignee: TAKAYANAGI MAKOTOPriority: Nov 1, 2007Filed: Apr 18, 2008Published: May 7, 2009
Est. expiryNov 1, 2027(~1.3 yrs left)· nominal 20-yr term from priority
Y10T29/49131Y10T29/49133Y10T156/17H05K 13/0417H05K 13/04Y10T29/4913Y10T29/53174
47
PatentIndex Score
0
Cited by
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References
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Claims

Abstract

A chip mounter has a manipulator and a bed. The manipulator picks up an electronic component from an electronic component feeding device, transfers the electronic component to the electronic component mounted surface of a printed board, and mounts the electronic component on the electronic component mounted surface. The bed is located above the manipulator or sidewise relative to the manipulator for mounting the printed board vertically or downwardly.

Claims

exact text as granted — not AI-modified
1 . A chip mounter which comprises
 a manipulator for picking up an electronic component from an electronic component feeding device, transferring the electronic component to the electronic component mounted surface of a printed board, and mounting the electronic component on the electronic component mounted surface, and   a bed located above said manipulator or sidewise relative to said manipulator for mounting said printed board vertically or downwardly.   
   
   
       2 . A chip mounter according to  claim 1  in which the adhesive for electronic component has an adhesive force to such a degree that the electronic component does not fall down before hardening. 
   
   
       3 . A chip mounter according to  claim 1  in which the adhesive for electronic component is hardened or half hardened just before or just after mounting of the chip to prevent falling down of the electronic component.

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