Expandable polishing platen device

Abstract

An expandable polishing platen device is disclosed, in which a polishing platen top includes a plurality of separate platen top sections. When the polishing platen device is not in an expanded configuration, the polishing platen top has a surface constructed from the surfaces of a first group of platen top sections. When the polishing platen device is in an expanded configuration, the polishing platen top has a surface constructed from the surfaces of the first group of platen top sections and a second group of platen top sections. Polishing pads are bonded to the surface of each of platen top sections respectively and may include various types. Therefore, the expandable polishing platen device of the present invention may have versatile polishing functions.

1 . An expandable polishing platen device, comprising:
 a pedestal;   an expandable polishing platen top disposed on the pedestal, wherein the polishing platen top comprises a plurality of separate platen top sections comprising a first group of platen top sections having a shifting mechanism and a second group of platen top sections having a raising mechanism, wherein, when the polishing platen top is not expanded, the first group of platen top sections are arranged to abut each other compactly, and the polishing platen top is expanded through shifting the first group of platen top sections and raising the second group of platen top sections to compactly arrange the first group of platen top sections and the second group of platen top sections; and   a plurality of polishing pads bonded to the platen top sections respectively.   
     
     
         2 . The expandable polishing platen device of  claim 1 , wherein the polishing pads comprise at least one type. 
     
     
         3 . The expandable polishing platen device of  claim 1 , wherein the polishing pads bonded to the first group of platen top sections are different from the polishing pads bonded to the second group of platen top sections. 
     
     
         4 . The expandable polishing platen device of  claim 1 , further comprises a trench structure between any two of the platen top sections. 
     
     
         5 . The expandable polishing platen device of  claim 1 , wherein one of the platen top sections is transparent for equipping an optical sensor. 
     
     
         6 . The expandable polishing platen device of  claim 1 , wherein one of the second group of platen top sections and a polishing pad thereon each comprise a hole corresponding to each other for injection of slurry or equipping a sensor. 
     
     
         7 . The expandable polishing platen device of  claim 1 , further comprising a plurality of groups of platen top sections arranged in a stack style under the second group of platen top sections, wherein, the polishing platen top is expanded stage by stage, from top to bottom through laterally shifting the over group of platen top sections by the shifting mechanism and raising the under group of platen top sections by the raising mechanism, to allow the over group of platen top sections and the under group of platen top sections to be compactly arranged. 
     
     
         8 . An expandable polishing platen device, comprising:
 a pedestal;   a guide plate disposed on the pedestal;   an expandable polishing platen top disposed on the guide plate, wherein the polishing platen top comprises a plurality of separate platen top sections comprising a first group of platen top sections and a second group of platen top sections, the first group of platen top sections are shiftable between positions defined by the guide plate and contiguously arranged in an unexpanded configuration, and the second group of platen top sections is removably disposed on the guide plate when the first group of platen top sections are shifted in an expanded configuration; and   a plurality of polishing pads bonded to the platen top sections respectively.   
     
     
         9 . The expandable polishing platen device of  claim 8 , further comprises a central plate disposed on the guide plate, wherein the central plate comprises receiving structures constructed and arranged to receive projecting structures provided on respective inner edges of the platen top sections, so that the platen top sections are arranged to abut each other compactly. 
     
     
         10 . The expandable polishing platen device of  claim 8 , wherein the polishing pads comprise at least one type. 
     
     
         11 . The expandable polishing platen device of  claim 8 , wherein the polishing pads bonded to the first group of platen top sections are different from the polishing pads bonded to the second group of platen top sections. 
     
     
         12 . The expandable polishing platen device of  claim 8 , further comprises a trench structure between any two of the platen top sections. 
     
     
         13 . The expandable polishing platen device of  claim 8 , wherein one of the platen top sections is transparent for equipping an optical sensor. 
     
     
         14 . The expandable polishing platen device of  claim 8 , wherein one of the second group of platen top sections and a polishing pad thereon each comprise a hole corresponding to each other for injection of slurry or equipping a sensor. 
     
     
         15 . An expandable polishing platen device, comprising:
 a pedestal;   an expandable polishing platen top disposed on the pedestal, wherein the polishing platen top comprises a plurality of separate platen top sections comprising a first group of platen top sections and a second group of platen top sections, the second group of platen top sections is connected to the first group of platen top sections through a first connection element and located under the first group of platen top sections, wherein, the polishing platen top is expanded through drawing the second group of platen top sections to be compactly arranged with the first group of platen top sections by the first connection element; and   a plurality of polishing pads bonded to the platen top sections respectively.   
     
     
         16 . The expandable polishing platen device of  claim 15 , wherein the second group of platen top sections and the first group of platen top sections are connected to each other in a folding style through the first connection element, such that the second group of platen top sections is located under the first group of platen top sections. 
     
     
         17 . The expandable polishing platen device of  claim 15 , wherein the first connection element comprises a hinge or an oil hydraulic arm. 
     
     
         18 . The expandable polishing platen device of  claim 16 , further comprises a third group of platen top sections connected to the second group of platen top sections in a folding style through a second connection element, such that the third group of platen top sections is located under the second group of platen top sections, and the polishing platen top is expanded through drawing the third group of platen top sections to be compactly arranged with the second group of platen top sections by the second connection element. 
     
     
         19 . The expandable polishing platen device of  claim 15 , wherein the second group of platen top sections and the first group of platen top sections are connected to each other in a drawer style through the first connection element, such that the second group of platen top sections is located under the first group of platen top sections, wherein the first connection element is a lifting/connection element. 
     
     
         20 . The expandable polishing platen device of  claim 19 , further comprises a third group of platen top sections connected to the second group of platen top sections in a drawing style through a second connection element, such that the third group of platen top sections is located under the second group of platen top sections, and the polishing platen top is expanded through drawing the third group of platen top sections to be compactly arranged with the second group of platen top sections by the second connection element, wherein the second connection element is a lifting/connection element.