Fpcb substrate and method of manufacturing the same

Abstract

A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface. The third surface of the insulation layer combines with the second surface of the electrically conductive layer. A through hole is defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer. The hook extends from the electrically conductive layer and passes through the through hole to protrude from the fourth surface of the insulation layer.

1 . A flexible printed circuit board substrate, comprising:
 an electrically conductive layer having a first surface and a second surface at an opposite side thereof to the first surface;   an insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface, the third surface of the insulation layer coming into contact with the second surface of the electrically conductive layer;   a through hole defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer; and   a hook extending from the electrically conductive layer through the through hole and protruding out from the fourth surface of the insulation layer.   
     
     
         2 . The flexible printed circuit board substrate as claimed in  claim 1 , wherein the hook is a unitary portion of the electrically conductive layer. 
     
     
         3 . The flexible printed circuit board substrate as claimed in  claim 1 , wherein the hook comprises a first end and a second end, the first end is connected with the electrically conductive layer, and the second end passes through the through hole and is curved or obliquely oriented relative to the fourth surface of the insulation layer. 
     
     
         4 . The flexible printed circuit board substrate as claimed in  claim 1 , wherein a length of the hook is larger than a combined thickness of the electrically conductive layer and the insulation layer. 
     
     
         5 . The flexible printed circuit board substrate as claimed in  claim 1 , wherein the length of the hook is in a range from about 1 millimeter to about 3 millimeters. 
     
     
         6 . A method for manufacturing the flexible printed circuit board substrate, the method comprising:
 providing a flexible printed circuit board material comprising an insulation layer and an electrically conductive layer formed on the insulation layer, the electrically conductive layer having a first surface and a second surface at an opposite side thereof to the first surface, the insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface, the third surface of insulation layer coming into contact with the second surface of the electrically conductive layer;   forming a first through hole extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer, the first through hole comprising a metal hole in the electrically conductive layer and an insulation hole in the insulation layer;   enlarging the insulation hole to expose a portion of the electrically conductive layer around the metal hole; and   bending the exposed portion of the electrically conductive layer to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.   
     
     
         7 . The method as claimed in  claim 6 , wherein the first through hole is formed by the steps of:
 forming a first metal hole in the electrically conductive layer;   enlarging the first metal hole to form a second metal hole;   forming a first insulation hole corresponding to the second metal hole in the insulation layer, thereby the first insulation hole and the second metal hole cooperatively constituting the first through hole.   
     
     
         8 . The method as claimed in  claim 7 , wherein the first metal hole is formed by a chemical etching method, and the diameter of the first metal hole is in a range from about 0.5 millimeters to about 1.5 millimeters. 
     
     
         9 . The method as claimed in  claim 8 , wherein the second metal hole is formed using a laser bombarding method, and the diameter of the second metal hole is in a range from about 1 millimeter to about 2 millimeters. 
     
     
         10 . The method as claimed in  claim 6 , wherein the insulation hole is enlarged using a laser bombarding method, and a diameter of the enlarged insulation hole is in a range from about 4 millimeters. 
     
     
         11 . A flexible printed circuit board substrate comprising:
 an electrically conductive layer;   an insulation layer coming into contact with the electrically conductive layer;   a through hole defined in the electrically conductive layer and the insulation layer; and   a portion of the electrically conductive layer surrounding the through hole extending through the through hole and protruding out from a surface of the insulation layer.   
     
     
         12 . The flexible printed circuit board substrate as claimed in  claim 11 , wherein the portion of the electrically conductive layer protrudes from the surface of the insulation layer to form a hook. 
     
     
         13 . The flexible printed circuit board substrate as claimed in  claim 12 , wherein the hook is curved or obliquely oriented relative to the surface of the insulation layer. 
     
     
         14 . The flexible printed circuit board substrate as claimed in  claim 12 , a length of the hook is larger than a combined thickness of the electrically conductive layer and the insulation layer. 
     
     
         15 . The flexible printed circuit board substrate as claimed in  claim 14 , wherein the length of the hook is in a range from about 1 millimeter to about 3 millimeters.