Method for the surface peening of a component

Abstract

The present technology relates generally to a method for surface peening, particularly shot peening, of a component, particularly a gas turbine component, in which peening bodies, particularly peening bodies designed as balls, are directed onto a surface of a component being peened, in order to machine or strengthen the surface of the component. According to certain embodiments of the present technology, the temperature and/or the velocity of the peening bodies is measured to establish process control of surface peening.

1 . A method for machining or strengthening the surface area of a component comprising the steps of:
 surface peening the component by directing peening bodies onto a peening surface of the component; and   measuring at least one of the temperature or the velocity of the peening bodies;   wherein at least one of the measured temperature or the measured velocity of the peening bodies is used to establish control of the surface peening process.   
     
     
         2 . The method of  claim 1 , wherein the component is a component of a gas turbine. 
     
     
         3 . The method of  claim 1 , wherein the surface peening step is a shot peening process. 
     
     
         4 . The method of  claim 3 , wherein the surface peening step is achieved using ultrasonic shot peening. 
     
     
         5 . The method of  claim 1 , wherein the peening bodies are balls. 
     
     
         6 . The method of  claim 1 , wherein the measuring step measures both the temperature and the velocity of the peening bodies. 
     
     
         7 . The method of  claim 1 , wherein the velocity of the peening bodies is measured at a point adjacent to the peening surface of the component. 
     
     
         8 . The method of  claim 1 , further comprising the step of measuring the temperature of the peening surface of the component. 
     
     
         9 . The method of  claim 1 , wherein at least one of the temperature or the velocity of the peening bodies is recorded using infrared measurement. 
     
     
         10 . The method of  claim 9 , wherein the temperature of the peening bodies is recorded using infrared measurement. 
     
     
         11 . The method of  claim 9 , wherein the velocity of the peening bodies is recorded using infrared measurement. 
     
     
         12 . The method of  claim 9 , wherein the temperature and the velocity of the peening bodies are recorded using infrared measurement. 
     
     
         13 . The method of  claim 8 , wherein at least one of the temperature or the velocity of the peening bodies is recorded using infrared measurement. 
     
     
         14 . The method of  claim 8 , wherein the temperature of the peening surface of the component is recorded using infrared measurement. 
     
     
         15 . The method of  claim 8 , wherein the temperature of the peening bodies, the velocity of the peening bodies and the temperature of the peening surface of the component is recorded using infrared measurement. 
     
     
         16 . The method of  claim 1 , wherein the surface peening step is regulated or controlled based on at least one of the temperature or the velocity of the peening bodies. 
     
     
         17 . The method of  claim 16 , wherein the surface peening step is regulated or controlled based on the temperature and the velocity of the peening bodies. 
     
     
         18 . The method of  claim 8 , wherein the surface peening step is regulated or controlled based on at least one of the temperature of the peening bodies, the velocity of the peening bodies, or the temperature of the peening surface of the component. 
     
     
         19 . The method of  claim 18 , wherein the surface peening step is regulated or controlled based on the temperature of the peening surface of the component. 
     
     
         20 . The method of  claim 18 , wherein the surface peening step is regulated or controlled based on the temperature of the peening bodies, the velocity of the peening bodies, and the temperature of the peening surface of the component.