Double-layer shutter control method of multi-sputtering system

Abstract

A double-layer shutter control method of a multi-sputtering system provided with three targets in a single chamber and a double-layer rotating shutter mechanism having shutter plates which independently rotate and have holes formed therein, comprising selecting a target by a combination of holes of a first shutter plate and a second shutter plate and uses the selected target for a pre-sputtering step and a main sputtering step with continuous discharge so as to deposit a film on a substrate, whereby it is possible to prevent cross-contamination between targets due to target substances etc. deposited on the shutter plates.

1 . A sputtering system comprising:
 a film-forming chamber in which a sputtering process is performed,   a substrate holder for holding a substrate, which is arranged in the film-forming chamber,   a means for attaching a first target and a second target whose substances are different, which is arranged in the film-forming chamber, and   a shutter mechanism arranged in the film-forming chamber, having a shutter plate with passing parts through which sputtered particles pass and intercept parts for intercepting the sputtered particles when performing the sputtering process, and a rotation driving means for rotating the shutter plate,   wherein the shutter mechanism has a control means for controlling the rotation driving means in order to rotate the shutter plate for changing positions of the passing parts and intercept parts so that, when performing the sputtering process, the intercept part intercepts the sputtered particles from the first target to the substrate so as to make a film-deposited spot on the intercept part, then a portion of the intercept part is placed at a position of the film-deposited spot, and then the sputtered particles from the first target pass through the passing part for the substrate and the sputtered particles from the second target are deposited on another spot on the intercept part which is different from the film-deposited spot.   
   
   
       2 . A sputtering system comprising:
 a film-forming chamber in which a sputtering process is performed,   a substrate holder for holding a substrate, which is arranged in the film-forming chamber,   a means for attaching a first target and a second target whose substances are different, which is arranged in the film-forming chamber, and   a shutter mechanism arranged in the film-forming chamber, having a first shutter plate and a second shutter plate, each of which has passing parts through which sputtered particles pass and intercept parts for intercepting the sputtered particles, when performing the sputtering process, and a rotation driving means for rotating the first and second shutter plates independently,   wherein the shutter mechanism has a control means for controlling the rotation driving means in order to rotate the first and second shutter plates for changing positions of the passing parts and the intercept parts of the first and second shutter plates so that, when performing the sputtering process, the intercept part of the first shutter plate intercepts the sputtered particles from the first target to the substrate so as to make a film-deposited spot on the intercept part of the first shutter plate, then a portion of the intercept part is placed at a position of the film-deposited spot by rotating the first shutter plate, and then the sputtered particles from the first target pass through the passing parts of the first and second shutter plates for the substrate and the sputtered particles from the second target are deposited on the intercept parts of the second shutter plate by rotating the first and second shutter plates.