Polyarylene Sulfide Film

Abstract

It is aimed to provide a polyarylene sulfide film for an acoustic instrument vibrating plate excellent in heat resistance, molding processability, acoustic properties, and also heat moldability. Provided is a polyarylene sulfide film wherein the elongation at break in either a longitudinal direction or a width direction of the film is 100% or more and 250% or less, and the Young's modulus in either a longitudinal direction or a width direction of the film is 1.5 GPa or more and less than 4 GPa.

1 . A polyarylene sulfide film wherein the elongation at break in either a longitudinal direction or a width direction of the film is 100% or more and 250% or less, and the Young's modulus in either a longitudinal direction or a width direction of the film is 1.5 GPa or more and less than 4 GPa. 
   
   
       2 . The polyarylene sulfide film of  claim 1 , wherein the elongation at break in both a longitudinal direction and a width direction of the film is 100% or more and 250% or less, and the Young's modulus in both a longitudinal direction and a width direction of the film is 1.5 GPa or more and less than 4 GPa. 
   
   
       3 . The polyarylene sulfide film of  claim 1 , wherein the thickness of the film is 3 μm or more and 100 μm or less. 
   
   
       4 . The polyarylene sulfide film of  claim 1 , comprising a thermoplastic resin (Y) other than polyarylene sulfide, wherein the content of the thermoplastic resin (Y) is 1 to 40 parts by weight when the sum of contents of polyarylene sulfide and the thermoplastic resin (Y) is 100 parts by weight. 
   
   
       5 . The polyarylene sulfide film of  claim 1 , comprising an inert particle by 0.1 to 30 parts by weight relative to 100 parts by weight in total of polymers constituting the film. 
   
   
       6 . The polyarylene sulfide film of  claim 4 , comprising an inert particle by 0.6 to 30 parts by weight relative to 100 parts by weight in total of polymers constituting the film, and a thermoplastic resin (Y) other than polyarylene sulfide by 1 to 40 parts by weight relative to 100 parts by weight in total of polymers constituting the film. 
   
   
       7 . The polyarylene sulfide film of  claim 5 , wherein the particle diameter of the inert particle is 0.1 μm or more and 3 μm or less. 
   
   
       8 . The polyarylene sulfide film of  claim 5 , wherein the inert particle is at least one kind selected from calcium carbonate and silica. 
   
   
       9 . The polyarylene sulfide film of  claim 4 , wherein the thermoplastic resin (Y) is at least one kind selected from the group consisting of polyamide, polyetherimide, polysulfone and polyether sulfone. 
   
   
       10 . The polyarylene sulfide film of  claim 4 , wherein the average dispersion diameter of the thermoplastic resin (Y) is 0.01 to 2 μm. 
   
   
       11 . The polyarylene sulfide film of  claim 4 , wherein the average dispersion diameter of the thermoplastic resin (Y) is 0.05 to 0.5 μm. 
   
   
       12 . The polyarylene sulfide film of  claim 1 , wherein the polyarylene sulfide is polyphenylene sulfide. 
   
   
       13 . The polyarylene sulfide film of  claim 1 , which is a film for heat molding. 
   
   
       14 . The polyarylene sulfide film of  claim 1 , which is a film for an acoustic instrument vibrating plate. 
   
   
       15 . The polyarylene sulfide film of  claim 1 , wherein the glass transition temperature thereof is observed at 85° C. or more to less than 95° C., and not observed at 95° C. or more to 130° C. or less. 
   
   
       16 . The polyarylene sulfide film of  claim 4 , comprising a silicon atom constituting a siloxane bond in an interface of a dispersed phase composed of the thermoplastic resin (Y). 
   
   
       17 . A method of producing the polyarylene sulfide film of  claim 1 , comprising the step of subjecting a resin composition obtained by kneading raw materials comprising polyarylene sulfide, thermoplastic resin (Y), and 0.1 to 10 parts by weight of a compatible plasticizer having at least one kind of group selected from the group consisting of an epoxy group, an amino group and an isocyanate group to a melt film-forming.