Storage system for components incorporating a liquid-metal thermal interface

Abstract

Embodiments of an apparatus that functions as a storage system for components are described. This apparatus includes a containment vessel enclosing a desiccant and a device. This device includes a layer mechanically coupled to a component, where the component can be one of a semiconductor die and a heat-removal device. Moreover, a thermal-interface material is coupled to a region of the layer, and a boundary material is mechanically coupled to the layer, where a perimeter defined by the boundary-material surrounds the region.

1 . An apparatus, comprising:
 a containment vessel enclosing a desiccant and a device, wherein the device includes:
 a layer mechanically coupled to a component, wherein the component can be one of a semiconductor die and a heat-removal device; 
 a thermal-interface material coupled to a region of the layer; and 
 a boundary material mechanically coupled to the layer, wherein a perimeter defined by the boundary-material surrounds the region. 
   
   
   
       2 . The apparatus of  claim 1 , further comprising an exterior containment vessel enclosing the containment vessel. 
   
   
       3 . The apparatus of  claim 1 , further comprising another desiccant within the exterior containment vessel but outside of the containment vessel. 
   
   
       4 . The apparatus of  claim 1 , wherein the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die. 
   
   
       5 . The apparatus of  claim 1 , wherein at least one of the layer and an inner surface of the boundary material includes a material that is resistant to corrosion by the thermal-interface material. 
   
   
       6 . The apparatus of  claim 5 , wherein the material includes a metal. 
   
   
       7 . The apparatus of  claim 5 , wherein the material includes nickel, a nickel alloy, or stainless steel. 
   
   
       8 . The apparatus of  claim 1 , wherein at least one of the layer and an inner surface of the boundary material includes a material that has a permeability for water that is less than a pre-determined value. 
   
   
       9 . The apparatus of  claim 1 , wherein the layer is deposited or adhered onto the component. 
   
   
       10 . The apparatus of  claim 1 , wherein the boundary material is mechanically coupled to the layer by grease. 
   
   
       11 . The apparatus of  claim 1 , wherein the semiconductor die includes a processor. 
   
   
       12 . The apparatus of  claim 1 , wherein the thermal-interface material includes a gallium-indium-tin alloy. 
   
   
       13 . An apparatus, comprising:
 a layer mechanically coupled to a component, wherein the component can be one of a semiconductor die and a heat-removal device;   another layer mechanically coupled to another component;   a thermal-interface material between the component and the other component, wherein the thermal-interface material is mechanically coupled to a region of the layer and to a region of the other layer; and   a boundary material mechanically coupled to the layer and the other layer, wherein the thermal-interface material is contained in a cavity defined, at least in part, by the layer, the boundary material, and the other layer.   
   
   
       14 . The apparatus of  claim 13 , further comprising a desiccant within the cavity. 
   
   
       15 . The apparatus of  claim 13 , wherein the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die. 
   
   
       16 . The apparatus of  claim 13 , wherein at least one of the layer, the other layer and an inner surface of the boundary material includes a material that is resistant to corrosion by the thermal-interface material. 
   
   
       17 . The apparatus of  claim 16 , wherein the material includes a metal. 
   
   
       18 . The apparatus of  claim 16 , wherein the material includes nickel, a nickel alloy, or stainless steel. 
   
   
       19 . The apparatus of  claim 13 , wherein at least one of the layer, the other layer and an inner surface of the boundary material includes a material that has a permeability for water that is less than a pre-determined value. 
   
   
       20 . The apparatus of  claim 13 , wherein the layer is deposited or adhered onto the component. 
   
   
       21 . The apparatus of  claim 13 , wherein the boundary material is mechanically coupled to the layer and the other layer by grease. 
   
   
       22 . The apparatus of  claim 13 , wherein the semiconductor die includes a processor. 
   
   
       23 . The apparatus of  claim 13 , wherein the thermal-interface material includes a gallium-indium-tin alloy. 
   
   
       24 . The apparatus of  claim 13 , further comprising:
 a containment vessel enclosing the apparatus; and   a desiccant within the containment vessel.