Semiconductor component and method of manufacture

Abstract

A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection molding process. The heatsink has a front surface for mating with a semiconductor chip and a leadframe assembly. The heatsink also has a back surface from which a plurality of fins extend. The leadframe assembly includes a leadframe having leadframe leads extending from opposing sides of the leadframe to a central area of the leadframe. A liquid crystal polymer is disposed in a ring-shaped pattern on the leadframe leads. The liquid-crystal polymer is partially cured. The leadframe assembly is mounted on the front surface of the heatsink and the liquid crystal polymer is further cured to form a packaging assembly, which is then singulated into packaging substrates.

1 - 44 . (canceled) 
     
     
         45 . An apparatus, comprising:
 a heatsink having first and second major surfaces;   a leadframe having at least one leadframe lead; and   a liquid crystal polymer disposed on a portion of the at least one leadframe lead;   wherein the liquid crystal polymer is mated to the heatsink.   
     
     
         45 . An apparatus as claimed in  claim 45 , the heatsink comprising a platform that serves as a die receiving area. 
     
     
         46 . An apparatus as claimed in  claim 45 , wherein the heatsink includes one or more fins extending from the second major surface thereof. 
     
     
         47 . An apparatus as claimed in  claim 45 , wherein the heatsink includes one or more fins extending from the second major surface thereof, at least one or more of the fins having a quadrilateral shape. 
     
     
         48 . An apparatus as claimed in  claim 45 , wherein the heatsink includes three or more fins extending from the second major surface thereof, three or more of the fins have a quadrilateral shape and are substantially parallel to each other. 
     
     
         49 . An apparatus as claimed in  claim 45 , wherein the heatsink includes one or more fins extending from the second major surface thereof, wherein one or more of the fins has a pyramidal shape. 
     
     
         50 . An apparatus as claimed in  claim 45 , wherein the leadframe comprises first and second opposing sides spaced apart from each other by a central area, wherein a first leadframe lead extends from the first side into the central area and a second leadframe lead extends from the second side into the central area. 
     
     
         51 . An apparatus as claimed in  claim 45 , wherein the liquid crystal polymer has a ring-shaped pattern having first and second opposing sides and third and fourth opposing sides, and wherein the first side of the ring-shaped pattern is disposed on the first leadframe lead and the second side of the ring-shaped pattern is disposed on the second leadframe lead. 
     
     
         52 . An apparatus as claimed in  claim 51 , wherein the first side of the ring-shaped pattern is disposed on a central portion of the first leadframe lead and the second side of the ring-shaped pattern is disposed adjacent an end of the ring-shaped pattern. 
     
     
         53 . An apparatus as claimed in  claim 45 , wherein the leadframe has first and second opposing sides spaced apart from each other by a central area, wherein a plurality of leadframe leads extends from the first side into the central area and a plurality of lead extends from the second side into the central area. 
     
     
         54 . An apparatus as claimed in  claim 45 , wherein the liquid crystal polymer is disposed in a ring-shaped pattern having first and second opposing sides and third and fourth opposing sides, and wherein the first side of the ring-shaped pattern is disposed on the plurality of leadframe leads extending from the first side of the leadframe and the second side of the ring-shaped pattern is disposed on the plurality of leadframe leads extending from the second side of the leadframe. 
     
     
         56 . An apparatus as claimed in  claim 53 , wherein the leadframe further has third and fourth opposing sides spaced apart from each other by the central area, wherein a plurality of leadframe leads extends from the third side into the central area and a plurality of leadframe leads extends from the fourth side into the central area, and wherein the step of disposing the liquid crystal polymer includes disposing the third side of the ring-shaped pattern on the plurality of leadframe leads extending from the third side and disposing the fourth side of the ring-shaped pattern on the plurality of leadframe leads extending from the fourth side. 
     
     
         57 . An apparatus as claimed in  claim 45 , further comprising:
 a semiconductor chip having first and second major surfaces, wherein a gate structure is formed over the first major surface; and   wherein the first major surface of the semiconductor chip is coupled with the first major surface of the heatsink.   
     
     
         58 . An apparatus as claimed in  claim 57 , wherein a metallization system is disposed on the first major surface of the semiconductor chip; and
 wherein the first major surface of the semiconductor chip is coupled with the first major surface of the heatsink via solder.   
     
     
         59 . An apparatus as claimed in  claim 58 , wherein the metallization system comprises one of a tin-nickel-gold metallization system or a tin-nickel-silver metallization system, or combinations thereof. 
     
     
         60 . An apparatus as claimed in  claim 57 , further comprising a metal clip coupled to the second side of the semiconductor chip and to a first leadframe lead of the plurality of leadframe leads. 
     
     
         61 . An apparatus as claimed in  claim 57 , further comprising a lid disposed over the semiconductor chip, wherein a portion of the lid is coupled to the metal clip. 
     
     
         62 . An apparatus as claimed in  claim 57 , further comprising:
 a metallization system on the second major surface of the semiconductor chip; and   a metal clip soldered to the metallization system on the second major surface of the semiconductor chip.   
     
     
         63 . An apparatus as claimed in  claim 62 , wherein the metallization system on the second major surface of the semiconductor chip comprises aluminum with a nickel-gold alloy disposed thereon. 
     
     
         64 . An apparatus as claimed in  claim 57 , wherein the gate structure is electrically coupled to a second leadframe lead of the plurality of leadframe leads. 
     
     
         65 . An apparatus as claimed in  claim 64 , wherein the lid is soldered to the semiconductor chip. 
     
     
         66 . An apparatus as claimed in  claim 57 , further comprising at least one other semiconductor chip coupled to the heatsink. 
     
     
         67 . An apparatus as claimed in  claim 66 , further comprising a switching chip and a mixed signal integrated circuit coupled to the heatsink.